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W19B160BBB8M PDF预览

W19B160BBB8M

更新时间: 2024-11-05 19:19:39
品牌 Logo 应用领域
华邦 - WINBOND 内存集成电路
页数 文件大小 规格书
48页 534K
描述
Flash, 1MX16, 8ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48

W19B160BBB8M 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48针数:48
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.84
最长访问时间:8 ns备用内存宽度:8
启动块:BOTTOMJESD-30 代码:R-PBGA-B48
长度:8 mm内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL编程电压:2.7 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM类型:NOR TYPE
宽度:6 mmBase Number Matches:1

W19B160BBB8M 数据手册

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W19B160BT/B DATA SHEET  
-Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 4  
FEATURES................................................................................................................................. 4  
PIN CONFIGURATIONS ............................................................................................................ 6  
BLOCK DIAGRAM ...................................................................................................................... 7  
PIN DESCRIPTION..................................................................................................................... 8  
FUNCTIONAL DESCRIPTION ................................................................................................... 9  
6.1  
DEVICE BUS OPERATION............................................................................................ 9  
6.1.1 Word/Byte Configuration...................................................................................................9  
6.1.2 Reading Array Data..........................................................................................................9  
6.1.3 Writing Commands/Command Sequences.......................................................................9  
6.1.4 Program and Erase Operation Status...............................................................................9  
6.1.5 Standby Mode ..................................................................................................................9  
6.1.6 Automatic Sleep Mode ...................................................................................................10  
6.1.7 #RESET: Hardware Reset Pin........................................................................................10  
6.1.8 Output Disable Mode......................................................................................................10  
6.1.9 Auto-select Mode............................................................................................................10  
6.1.10 Sector Protection and Un-protection.............................................................................11  
6.1.11 Temporary Sector Unprotect ........................................................................................11  
6.1.12 Hardware Data Protection ............................................................................................11  
6.1.13 Write Pulse “Glitch” Protection......................................................................................11  
6.1.14 Logical Inhibit................................................................................................................11  
6.1.15 Power-Up Write Inhibit..................................................................................................11  
6.2  
COMMAND DEFINITIONS........................................................................................... 12  
6.2.1 Reading Array Data........................................................................................................12  
6.2.2 Reset Command.............................................................................................................12  
6.2.3 Auto-select Command Sequence...................................................................................12  
6.2.4 Byte/Word Program Command Sequence......................................................................13  
6.2.5 Chip Erase Command Sequence ...................................................................................13  
6.2.6 Sector Erase Command Sequence ................................................................................13  
6.2.7 Erase Suspend /Erase Resume Commands ..................................................................14  
6.2.8 Unlock Bypass Command Sequence .............................................................................14  
6.3  
WRITE OPERATION STATUS..................................................................................... 15  
6.3.1 DQ7: #Data Polling.........................................................................................................15  
6.3.2 RY/#BY: Ready/#Busy....................................................................................................15  
Publication Release Date:Jan.04, 2008  
- 1 -  
Revision A5  

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