VS-GT200TS065S
Vishay Semiconductors
www.vishay.com
“Half Bridge” Low VCE(on) IGBT INT-A-PAK, 200 A
FEATURES
• Trench IGBT technology
• Gen 4 FRED Pt® technology anti-parallel diodes
with ultra soft reverse recovery characteristics
• Very low conduction losses
• Al2O3 DBC
• UL approved file E78996
• Designed for industrial level
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
INT-A-PAK IGBT
BENEFITS
• Optimized for high current inverter stages (AC TIG welding
machines)
PRIMARY CHARACTERISTICS
• Direct mounting to heatsink
• Very low junction to case thermal resistance
• Low EMI
VCES
650 V
378 A
I
C DC, TC = 80 °C
V
CE(on) at 200 A, 25 °C
1.09 V
Chip level VCE(on) at 200 A, 25 °C
Speed
0.98 V
DC to 1 kHz
INT-A-PAK
Half bridge
Package
Circuit configuration
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
650
UNITS
Collector to emitter voltage
VCES
V
TC = 25 °C
C = 80 °C
476
Continuous collector current
Pulsed collector current
IC
ICM
IF
T
378
TC = 175 °C, tp = 6 ms, VGE = 15 V
TC = 25 °C
810
57
A
Diode continuous forward current
T
C = 80 °C
43
Maximum non-repetitive peak current
Peak switching current
IFSM
ILM
10 ms sine or 6 ms rectangular pulse
270
320
Gate to emitter voltage
VGE
20
V
RMS isolation voltage
VISOL
Any terminal to case, t = 1 min
TC = 25 °C
2500
1000
633
Maximum power dissipation
PD
PD
T
C = 80 °C
W
°C
TC = 25 °C
150
Maximum power dissipation (Diode)
T
C = 80 °C
95
Operating junction temperature range
Storage temperature range
TJ
-40 to +175
-40 to +150
TStg
Revision: 28-Jul-2023
Document Number: 97091
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000