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VN330SP PDF预览

VN330SP

更新时间: 2024-11-07 22:15:39
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 外围驱动器驱动程序和接口接口集成电路继电器固态继电器光电二极管
页数 文件大小 规格书
9页 72K
描述
QUAD HIGH SIDE SMART POWER SOLID STATE RELAY

VN330SP 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:HSOP, SOP10,.55FL针数:10
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.79
Is Samacsys:N内置保护:OVER CURRENT; THERMAL; UNDER VOLTAGE
驱动器位数:4接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:R-PDSO-G10JESD-609代码:e3
长度:9.4 mm功能数量:4
端子数量:10输出电流流向:SOURCE
最大输出电流:0.5 A封装主体材料:PLASTIC/EPOXY
封装代码:HSOP封装等效代码:SOP10,.55FL
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG
峰值回流温度(摄氏度):NOT SPECIFIED电源:24 V
认证状态:Not Qualified座面最大高度:3.75 mm
子类别:Peripheral Drivers最大供电电压:36 V
最小供电电压:10 V标称供电电压:24 V
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:30 µs接通时间:40 µs
宽度:7.5 mmBase Number Matches:1

VN330SP 数据手册

 浏览型号VN330SP的Datasheet PDF文件第2页浏览型号VN330SP的Datasheet PDF文件第3页浏览型号VN330SP的Datasheet PDF文件第4页浏览型号VN330SP的Datasheet PDF文件第5页浏览型号VN330SP的Datasheet PDF文件第6页浏览型号VN330SP的Datasheet PDF文件第7页 
VN330SP  
QUAD HIGH SIDE SMART  
POWER SOLID STATE RELAY  
TYPE  
Vdemag  
*
RDS(on)  
*
IOUT  
*
VCC  
VN330SP VCC-55V 0.32 **  
0.7 A  
36 V  
* per Channel  
** at TJ = 85 oC  
OUTPUT CURRENT: 0.7A PER CHANNEL  
DIGITAL INPUTS CLAMPED AT 32V  
MINIMUM VOLTAGE  
10  
SHORTED LOAD AND  
1
OVERTEMPERATURE PROTECTIONS  
BUILT-IN CURRENT LIMITER  
UNDER VOLTAGE SHUT DOWN  
OPEN DRAIN DIAGNOSTIC OUTPUT  
Power SO-10 TM  
FAST DEMAGNETIZATION OF INDUCTIVE  
LOADS  
Active current limitation avoids dropping the  
system powersupply in case of shorted load.  
DESCRIPTION  
The VN330SP is a monolithic device made using  
Built-in thermal shut-down protects the chip from  
over temperature and short circuit.  
The open drain diagnostic output indicates short  
circuit and overtemperatureconditions.  
STMicroelectronics  
VIPower  
Technology,  
intended for driving four indipendent resistive or  
inductive loads with one side connected to  
ground.  
BLOCK DIAGRAM  
1/9  
February 1999  

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