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VLF302510MT-1R0N PDF预览

VLF302510MT-1R0N

更新时间: 2024-11-12 08:19:35
品牌 Logo 应用领域
东电化 - TDK 电感器固定电感器测试DC-DC转换器
页数 文件大小 规格书
3页 69K
描述
SMD Inductors

VLF302510MT-1R0N 数据手册

 浏览型号VLF302510MT-1R0N的Datasheet PDF文件第2页浏览型号VLF302510MT-1R0N的Datasheet PDF文件第3页 
(1/3)  
Conformity to RoHS Directive  
SMD Inductors(Coils)  
For Power Line(Wound, Magnetic Shielded)  
VLF-MT Series VLF302510MT  
With the VLF302510MT Series, a DC to DC converter with top-  
class voltage conversion efficiency for similar size products was  
achieved by optimizing the magnetic material and configuration.  
These products are optimal for use as choke coils in switching  
power supplies such as those in mobile devices requiring space-  
saving design.  
PRODUCT IDENTIFICATION  
VLF 302510M T - 1R0  
(1) (2) (3) (4) (5)  
N
(1) Series name  
(2) Dimensions L×W×H mm max.  
FEATURES  
(3) Packaging style  
T
• Miniature size  
Taping  
(Embossed carrier tape)  
Mount area: 3.0×2.5mm  
Low profile: 1.0mm max. height  
• Generic use for portable DC to DC converter line.  
• High magnetic shield construction should actualize high resolu-  
tion for EMC protection.  
(4) Inductance value  
1R0  
100  
1.0µH  
10µH  
• The products contain no lead and also support lead-free  
soldering.  
(5) Inductance tolerance  
M
N
20%  
30%  
• The products is halogen-free.  
• It is a product conforming to RoHS directive.  
PACKAGING STYLE AND QUANTITIES  
APPLICATIONS  
Packaging style  
Taping  
Quantity  
2000 pieces/reel  
Smartphones, cellular phones, DSCs, DVCs, HDDs, LCD displays,  
compact power supply modules, etc.  
HANDLING AND PRECAUTIONS  
SHAPES AND DIMENSIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the  
temperature difference between the solder temperature and  
product temperature does not exceed 150°C.  
2.5 0.2  
• When hand soldering, apply the soldering iron to the printed  
circuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
(
)
(
)
0.7  
0.7  
Weight: 0.026g  
(
)
0.8  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
Dimensions in mm  
RECOMMENDED PC BOARD PATTERN  
10s max.  
250 to 260˚C  
230˚C  
0.9  
0.9  
Natural  
cooling  
0.8 Dimensions in mm  
180˚C  
150˚C  
CIRCUIT DIAGRAM  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
002-02 / 20101028 / e531_vlf302510mt.

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