VISHAY VITRAMON
www.vishay.com
Ceramic Capacitors
Tech Note TN-0029
Vishay Vitramon MLCC End Termination
By Dmitry Kan, Carina Makarov, and Thomas Wächter
Sn: 100 % tin
plate matte finish
(W, X, Y) or Sn / Pb
tin / lead plate
matte finish with
a minimum of
Sn / Pb solder
coat finish with
minimum of
4 % lead
AgPd:
silver-
palladium
Sn: 100 %
tin plate
matte finish
Sn: 100 %
tin plate
matte finish
4 % lead (L, S, Z)
Ni:
nickel
plate
barrier
Ni:
nickel
plate
Ni:
Cu:
copper
barrier
nickel
plate
barrier
barrier
Polymer
Ag:
silver
Ag:
silver
Ag:
silver
Ag:
silver
Figure 1
Termination
codes: F, M, E
Figure 2
Termination codes:
L, S, W, X, Y, Z
Figure 3
Termination code: U
Figure 4
Termination code: B, W
Figure 5
Termination code: C
TERMINATION CODE
FROM PART NUMBERING
TERMINATION
DEFINITION
ACCEPTED ASSEMBLY
METHODS
F, M (3)
E (2)
Fired, thick film, silver / palladium
Fired, thick film, silver / palladium
Conductive epoxy
Conductive epoxy
Wave solder (1) / reflow solder /
vapor phase reflow
Copper with an outer layer of 100 % tin plate matte finish
for multi-solder mounting
C (6)
Wave solder (1) / reflow solder /
vapor phase reflow
Fired, thick film silver, covered by 100 % nickel barrier plate with an outer
layer of 100 % tin plate matte finish for multi-solder mounting
W (3), X, Y (3)
Fired, thick film silver, cover by 100 % nickel barrier plate with an
outer layer of tin / lead plate matte finish with a minimum of 4 % lead
for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
L, S (7), Z (3)
Fired, thick film silver, cover by 100 % nickel barrier plate with an
outer layer of tin / lead plate finish matte with a minimum of 4 % lead
for solder coat
Wave solder (1) / reflow solder /
vapor phase reflow
U (4)
Fired, thick film silver, cured thick film polymer silver, covered by
100 % nickel barrier plate with an outer layer of 100 % tin plate
matte finish for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
B
Fired, thick film silver, cured thick film polymer silver, covered by 100 %
nickel barrier plate with an outer layer of 100 % tin plate matte finish for
multi-solder mounting and improved bending capability performance
Wave solder (1) / reflow solder /
vapor phase reflow
W (5)
Notes
(1)
Case sizes 1111, 1206, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and case sizes 1825 and larger should NOT be wave soldered
Termination code “E” is for conductive epoxy assembly, contact mlcc@vishay.com for availability
Code in CDR and MIL-PRF-123 part numbers only
CDR “U” termination code: Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 % lead).
Solder has a melting point of + 200 °C or less. Solder coat thickness is a minimum of 60 microinches.
• Solder iron techniques are not recommended. For more information on soldering visit www.vishay.com/doc?45034
• Contact mlcc@vishay.com with respect to specific part number requirements
Code in safety, commercial, and automotive part numbers only
For “C” termination solder coverage should be at least 90 % of the terminal critical areas in soldering
MIL-PRF-123 part numbers only
(2)
(3)
(4)
(5)
(6)
(7)
Revision: 31-Jul-2020
Document Number: 45063
1
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000