B352F110T24

更新时间： 2024-01-03 15:58:01

品牌	Logo	应用领域
VICOR		模拟IC 信号电路输入元件
页数	文件大小	规格书
13页	394K
描述
VI Chip - BCM Bus Converter Module

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技术参数
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B352F110T24 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	DMA
包装说明：	,	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	5.83
Is Samacsys：	N	其他特性：	INPUT VOLTAGE RANGE IS 330V TO 365V
模拟集成电路 - 其他类型：	ANALOG CIRCUIT	JESD-30 代码：	R-XDMA-X
JESD-609代码：	e4	湿度敏感等级：	5
功能数量：	1	最高工作温度：	125 °C
最低工作温度：	-40 °C	封装主体材料：	UNSPECIFIED
封装形状：	RECTANGULAR	封装形式：	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
表面贴装：	NO	技术：	HYBRID
温度等级：	AUTOMOTIVE	端子面层：	NICKEL PALLADIUM GOLD
端子形式：	UNSPECIFIED	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

B352F110T24 数据手册

PRELIMINARY

V•I Chip Bus Converter Module

B352F110T24

BCM

V•I Chip – BCM

Bus Converter Module

• 352 V to 11.0 V V•I Chip Converter

• 240 Watt (360 Watt for 1 ms)

• High density – up to 876 W/in³

• Small footprint – 210 W/in²

• Low weight – 0.5 oz (14 g)

• Typical efficiency 95%

• 125°C operation

• <1 µs transient response

• >2.6 million hours MTBF

• No output filtering required

Vin = 330 - 365 V

Vout = 10.3 - 11.4 V

Iout = 21.8 A

• ZVS/ZCS isolated sine

amplitude converter

Actual size

K = 1/32

Rout = 15.0 mΩ max

Product Description

Absolute Maximum Ratings

The V•I Chip Bus Converter Module (BCM) is a high

efficiency (>95%), narrow input range Sine Amplitude

Converter (SAC) operating from a 330 to 365 Vdc

primary bus to deliver an isolated low voltage secondary.

The off-line BCM provides an isolated 10.3 -11.4 V

distribution bus and is ideal for use in silver boxes and

PFC front ends. Due to the fast response time and low

noise of the BCM, the need for limited life aluminum

electrolytic or tantalum capacitors at the input of POL

converters is reduced—or eliminated—resulting in

savings of board area, materials and total system cost.

Parameter

Values

-1.0 to 400

500

Unit

Vdc

Notes

+In to -In

For 100 ms

PC to -In

-0.3 to 7.0

-0.5 to 16.0

4,242

+Out to -Out

Isolation voltage

Output current

Peak output current

Output power

Input to Output

Continuous

For 1 ms

24.1

32.7

240

Continuous

For 1 ms

Peak output power

Case temperature

Operating junction temperature⁽¹⁾

360

The BCM achieves a power density of 876 W/in³in

a V•I Chip package compatible with standard pick-and-

place and surface mount assembly processes. The V•I

Chip package provides flexible thermal management

through its low Junction-to-Case and Junction-to-Board

thermal resistance. Owing to its high conversion

efficiency and safe operating temperature range, the

BCM does not require a discrete heat sink in typical

applications. Low junction to case and junction to lead

thermal impedances assure low junction temperatures

and long life in the harshest environments.

208

°C

During reflow

T - Grade

-40 to 125

-55 to 125

-40 to 150

-65 to 150

°C

M - Grade

T - Grade

Storage temperature

°C

M - Grade

Note:

(1) The referenced junction is defined as the semiconductor having the highest temperature.

This temperature is monitored by a shutdown comparator.

Part Numbering

352

110 T

Output Voltage

Designator

(=V^OUTx10)

Output Power

Designator

(=POUT/10)

Bus Converter

Module

Input Voltage

Designator

Configuration

(Figure 15)

Product Grade Temperatures (°C)

Grade

Storage

Operating

-40 to150 -40 to125

-65 to150 -55 to125

vicorpower.com

800-735-6200

V•I Chip Bus Converter Module

B352F110T24

Rev. 1.1

Page 1 of 13

12 3 4 5 6 7...13

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