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B048K160T24 PDF预览

B048K160T24

更新时间: 2022-12-11 22:14:08
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VICOR /
页数 文件大小 规格书
15页 578K
描述
VI Chip - BCM Bus Converter Module

B048K160T24 数据手册

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PRELIMINARY  
BCM  
TM  
V•I Chip – BCM  
Bus Converter Module  
• 48 V to 16 V V•I Chip Converter  
• 240 Watt (360 Watt for 1 ms)  
• High density – 974 W/in3  
• Small footprint – 220 W/in2  
• Low weight – 0.5 oz (14 g)  
B048K160T24  
K indicates BGA configuration. For other  
mounting options see Part Numbering below.  
Typical efficiency 96%  
• 125°C operation  
©
• <1 µs transient response  
• 3.5 million hours MTBF  
• No output filtering required  
Vin = 38 - 55 V  
Vout = 12.7 - 18.3 V  
Iout = 15.0 A  
K = 1/3  
Rout = 35.0 mmax  
• ZVS/ZCS isolated Sine  
Amplitude Converter  
• Surface mount BGA or J-Lead  
packages  
Actual size  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module (BCM) is a high  
efficiency (>96%), narrow input range Sine Amplitude  
Converter (SAC) operating from a 38 to 55 Vdc primary  
bus to deliver an isolated 12.7 V to 18.3 V secondary.  
The BCM may be used to power non-isolated POL  
converters or as an independent 12.7 – 18.3 V source.  
Due to the fast response time and low noise of the  
BCM, the need for limited life aluminum electrolytic or  
tantalum capacitors at the load is reduced—or  
eliminated—resulting in savings of board area, materials  
and total system cost.  
Parameter  
+In to -In  
Values  
-1.0 to 60.0  
100  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 25.0  
2,250  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Case temperature  
Input to Output  
Continuous  
For 1 ms  
20  
22.5  
A
240  
W
Continuous  
For 1 ms  
360  
W
The BCM achieves a power density of 974 W/in3 and  
may be surface mounted with a profile as low as 0.16"  
(4 mm) over the PCB. Its V•I Chip power package is  
compatible with onboard or inboard surface mounting.  
The V•I Chip package provides flexible thermal  
management through its low Junction-to-Case and  
Junction-to-BGA thermal resistance. Owing to its high  
conversion efficiency and safe operating temperature  
range, the BCM does not require a discrete heat sink in  
typical applications. Low junction to case and junction  
to lead thermal impedances assure low junction  
temperatures and long life in the harshest  
208  
°C  
During reflow  
Operating junction temperature(1) -40 to 125  
-55 to 125  
°C  
°C  
T - Grade  
M - Grade  
Storage temperature  
-40 to 150  
-65 to 150  
°C  
°C  
T - Grade  
M - Grade  
Note:  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
Part Numbering  
environments.  
B
048 K  
160 T  
24  
Output Voltage  
Designator  
(=VOUT x10)  
Output Power  
Designator  
(=POUT/10)  
Bus Converter  
Module  
Input Voltage  
Designator  
Configuration Options  
Product Grade Temperatures (°C)  
F
= Onboard (Figure 20)  
Grade  
T
M
Storage Operating  
-40 to150 -40 to125  
-65 to150 -55 to125  
K = Inboard (Figure 19)  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B048K160T24  
Rev. 1.0  
Page 1 of 15  

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