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B048G120T20

更新时间： 2024-01-04 12:40:52
品牌 Logo 应用领域
VICOR 输入元件
页数 文件大小 规格书
16页 516K
描述
Analog Circuit, 1 Func, Hybrid, MODULE, BGA-106

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B048G120T20 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：,针数：106
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.84其他特性：INPUT VOLTAGE RANGE IS 42V TO 53V
模拟集成电路 - 其他类型：ANALOG CIRCUITJESD-30 代码：R-XXMA-X106
功能数量：1端子数量：106
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY认证状态：Not Qualified
最大供电电压 (Vsup)：5.2 V最小供电电压 (Vsup)：4.8 V
标称供电电压 (Vsup)：5 V表面贴装：NO
技术：HYBRID温度等级：AUTOMOTIVE
端子形式：UNSPECIFIED端子位置：UNSPECIFIED
Base Number Matches：1

B048G120T20 数据手册

 浏览型号B048G120T20的Datasheet PDF文件第2页浏览型号B048G120T20的Datasheet PDF文件第3页浏览型号B048G120T20的Datasheet PDF文件第4页浏览型号B048G120T20的Datasheet PDF文件第5页浏览型号B048G120T20的Datasheet PDF文件第6页浏览型号B048G120T20的Datasheet PDF文件第7页 
TM  
1
V•I Chip – BCM  
Bus Converter Module  
B048K120T20  
Vin = 42 - 53 V  
Vout = 10.5 - 13.25 V  
• 48V to 12V V•I Chip Converter  
• 200 Watt (300 Watt for 1 mS)  
• High density – up to 800 W/in3  
• Small footprint – 200 W/in2  
• Low weight – 0.4 oz (12 g)  
• Pick & Place / SMD  
• >96% efficiency  
Iout = 17.0 A  
1
K = /  
4
• 125°C operation  
Rout = 25 mΩ max  
• 1 µs transient response  
• >3.5 million hours MTBF  
• No output filtering required  
• V•I ChipBGA package  
©
Actual size  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module  
(BCM) is a high efficiency (>96%),  
narrow input range Voltage  
Transformation Module (VTM) operating  
from a pre-regulated 48 Vdc primary bus  
to deliver an isolated 12 V secondary for  
Intermediate Bus Architecture  
applications. The BCM may be used to  
power non-isolated POL converters or as  
an independent 12 V source. Due to the  
fast response time and low noise of the  
BCM, the need for limited life aluminum  
electrolytic or tantalum capacitors at the  
input of POL converters is reduced—or  
eliminated—resulting in savings of board  
area, materials and total system cost.  
Parameter  
Values  
Unit  
Notes  
+In to -In  
-1.0 to 60.0  
100  
Vdc  
Vdc  
Vdc  
Vdc  
mA  
Vdc  
Vdc  
°C  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.3 to 7.0  
500  
TM to -In  
SG to -In  
+Out to -Out  
-0.5 to 15.0  
1500  
Isolation voltage  
Operating junction temperature  
Output current  
Input to Output  
See note 2  
Continuous  
For 1 ms  
-40 to 125  
17.0  
A
Peak output current  
Case temperature during reflow  
Storage temperature  
Output power  
25  
A
208  
°C  
-40 to 150  
200  
°C  
W
Continuous  
For 1 ms  
The BCM achieves a power density of  
800 W/in3 and may be surface mounted  
with a profile as low as 0.16" (4mm) over  
the PCB. Its V•I Chip power BGA package  
is compatible with on-board or in-board  
surface mounting. The V•I Chip package  
provides flexible thermal management  
through its low Junction-to-Case and  
Junction-to-BGA thermal resistance.  
Owing to its high conversion efficiency  
and safe operating temperature range, the  
BCM does not require a discrete heat sink  
in typical applications. It is also  
Peak output power  
300  
W
Thermal Resistance  
Symbol  
RθJC  
Parameter  
Typ  
1.1  
2.1  
6.5  
5.0  
Max  
Units  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-case  
Junction-to-BGA  
Junction-to-ambient3  
Junction-to-ambient4  
1.5  
2.5  
7.2  
5.5  
RθJB  
RθJA  
RθJA  
Notes  
1. For complete product matrix see chart on page 10.  
2. The referenced junction is defined as the semiconductor having the highest temperature. This  
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.  
compatible with heat sink options,  
assuring low junction temperatures and  
long life in the harshest environments.  
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 8 oz Cu total, 300 LFM.  
4. B048L120T20 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.  
Vicor Corporation  
Tel: 800-735-6200  
V•I Chip Bus Converter  
B048K120T20  
Rev. 1.7  
Page 1 of 16  
45  
vicorpower.com  
1234567...16

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