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B048G120T15 PDF预览

B048G120T15

更新时间: 2022-12-09 17:06:34
品牌 Logo 应用领域
VICOR /
页数 文件大小 规格书
16页 519K
描述
VI Chip - BCM Bus Converter Module

B048G120T15 数据手册

 浏览型号B048G120T15的Datasheet PDF文件第2页浏览型号B048G120T15的Datasheet PDF文件第3页浏览型号B048G120T15的Datasheet PDF文件第4页浏览型号B048G120T15的Datasheet PDF文件第5页浏览型号B048G120T15的Datasheet PDF文件第6页浏览型号B048G120T15的Datasheet PDF文件第7页 
TM  
1
V•I Chip – BCM  
Bus Converter Module  
B048K120T15  
Vin = 42 - 53 V  
Vout = 10.5 - 13.25 V  
• 48V to 12V V•I Chip Converter  
• 150 Watt (225 Watt for 1 ms)  
• High density – up to 600 W/in3  
• Small footprint – 150 W/in2  
• Low weight – 0.4 oz (12 g)  
• Pick & Place / SMD  
• >96% efficiency  
Iout = 12.5 A  
1
K = /  
4
• 125°C operation  
Rout = 32 mmax  
• <1 µs transient response  
• >3.5 million hours MTBF  
• No output filtering required  
• V•I ChipBGA package  
©
Actual size  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module  
(BCM) is a high efficiency (>96%),  
narrow input range Voltage  
Transformation Module (VTM) operating  
from a pre-regulated 48 Vdc primary bus  
to deliver an isolated 12 V secondary for  
Intermediate Bus Architecture  
applications. The BCM may be used to  
power non-isolated POL converters or as  
an independent 12 V source. Due to the  
fast response time and low noise of the  
BCM, the need for limited life aluminum  
electrolytic or tantalum capacitors at the  
input of POL converters is reduced—or  
eliminated—resulting in savings of board  
area, materials and total system cost.  
Parameter  
Values  
Unit  
Notes  
+In to -In  
-1.0 to 60.0  
100  
Vdc  
Vdc  
Vdc  
Vdc  
mA  
Vdc  
Vdc  
°C  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.3 to 7.0  
500  
TM to -In  
SG to -In  
+Out to -Out  
-0.5 to 15.0  
1500  
Isolation voltage  
Operating junction temperature  
Output current  
Input to Output  
See note 2  
Continuous  
For 1 ms  
-40 to 125  
12.5  
A
Peak output current  
Case temperature during reflow  
Storage temperature  
Output power  
18.7  
A
208  
°C  
-40 to 150  
150  
°C  
W
Continuous  
For 1 ms  
The BCM achieves a power density of  
600 W/in3 and may be surface mounted  
with a profile as low as 0.16" (4mm) over  
the PCB. Its V•I Chip power BGA package  
is compatible with on-board or in-board  
surface mounting. The V•I Chip package  
provides flexible thermal management  
through its low Junction-to-Case and  
Junction-to-BGA thermal resistance.  
Owing to its high conversion efficiency  
and safe operating temperature range, the  
BCM does not require a discrete heat sink  
in typical applications. It is also  
Peak output power  
225  
W
Thermal Resistance  
Symbol  
RθJC  
Parameter  
Typ  
1.1  
2.1  
6.5  
5.0  
Max  
Units  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-case  
Junction-to-BGA  
Junction-to-ambient3  
Junction-to-ambient4  
1.5  
2.5  
7.2  
5.5  
RθJB  
RθJA  
RθJA  
Notes  
1. For complete product matrix see chart on page 10.  
2. The referenced junction is defined as the semiconductor having the highest temperature. This  
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.  
compatible with heat sink options,  
assuring low junction temperatures and  
long life in the harshest environments.  
3. B048K120T15 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.  
4. B048L120T15 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.  
Vicor Corporation  
Tel: 800-735-6200  
V•I Chip Bus Converter  
B048K120T15  
Rev. 1.2  
Page 1 of 16  
45 vicorpower.com  

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