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B048F240T30 PDF预览

B048F240T30

更新时间: 2024-01-18 01:05:24
品牌 Logo 应用领域
VICOR 转换器模拟IC信号电路光电二极管
页数 文件大小 规格书
12页 1156K
描述
BCM Bus Converter

B048F240T30 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:SOJ,针数:56
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.40.60.12风险等级:5.81
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-PDSO-J56
JESD-609代码:e4长度:32.5 mm
湿度敏感等级:6功能数量:1
端子数量:56最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):245
认证状态:Not Qualified座面最大高度:6.98 mm
最大供电电压 (Vsup):53 V最小供电电压 (Vsup):38 V
标称供电电压 (Vsup):48 V表面贴装:YES
技术:HYBRID温度等级:AUTOMOTIVE
端子面层:NICKEL PALLADIUM GOLD端子形式:J BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:22 mmBase Number Matches:1

B048F240T30 数据手册

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B048F240T30  
B048F240M30  
TM  
BCM  
Bus Converter  
• 48 V to 24 V V•I ChipTM Converter  
• 300 Watt (450 Watt for 1 ms)  
• High density – 1017 W/in3  
• Small footprint – 260 W/in2  
• Low weight – 0.5 oz (15 g)  
Typical efficiency 96%  
• 125°C operation (TJ)  
©
• <1 µs transient response  
• 3.5 million hours MTBF  
• No output filtering required  
Vin = 38 - 53 V  
Vout = 19.0 - 26.5 V  
Iout = 12.5 A  
K = 1/2  
• ZVS / ZCS isolated Sine  
Amplitude Converter  
Rout = 60.0 mmax  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module is a high efficiency  
(>96%), narrow input range Sine Amplitude Converter  
(SAC) operating from a 38 to 53 Vdc primary bus to  
deliver an isolated 19.0 V to 26.5 V secondary. The BCM  
may be used to power non-isolated POL converters or as  
an independent 19.0 – 26.5 V source. Due to the fast  
response time and low noise of the BCM, the need for  
limited life aluminum electrolytic or tantalum capacitors  
at the load is reduced—or eliminated—resulting in  
savings of board area, materials and total system cost.  
Parameter  
Values  
-1.0 to 60  
100  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 50  
2,250  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Case temperature  
Input to output  
Continuous  
For 1 ms  
14.8  
18.8  
A
300  
W
Continuous  
For 1 ms  
The BCM achieves a power density of 1017 W/in3 in a  
V•I Chip package compatible with standard pick-and-  
place and surface mount assembly process. The V•I Chip  
package provides flexible thermal management through  
its low junction-to-board and junction-to-case thermal  
resistance. Owing to its high conversion efficiency and  
safe operating temperature range, the BCM does not  
require a discrete heat sink in typical applications. Low  
junction-to-case and junction-to-lead thermal  
450  
W
225  
°C  
During reflow MSL 5  
T-Grade  
-40 to 125  
°C  
Operating junction temperature(1)  
-55 to 125  
-40 to 125  
-65 to 125  
°C  
°C  
°C  
M-Grade  
T-Grade  
Storage temperature  
M-Grade  
Note:  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
impedances assure low junction temperatures and long  
life in the harshest environments.  
Part Numbering  
B
048 F 240  
Output Voltage  
Designator  
T
30  
Output Power  
Designator  
(=POUT/10)  
Bus Converter  
Module  
Input Voltage  
Designator  
(=VOUT x10)  
Configuration  
F = J-lead  
T = Through hole  
Product Grade Temperatures (°C)  
Grade  
Storage  
-40 to125  
-65 to 125  
Operating (TJ)  
T
-40 to125  
M
-55 to 125  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B048F240T30  
Rev. 2.3  
Page 1 of 12  

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