TM
1
V•I Chip – BCM
Bus Converter Module
• 48 V to 12 V V•I Chip Converter
• 200 Watt (300 Watt for 1 ms)
• High density – up to 800 W/in3
• Small footprint – 200 W/in2
• Low weight – 0.5 oz (14 g)
B048K120T20
Vin = 42 - 53 V
+V•I+
Vout = 10.5 - 13.25 V
• >96% efficiency
Iout = 17.0 A
1
– –
K = /
4
• 125°C operation
K
Rout = 25 mΩ max
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• BGA or J-Lead packages
©
• ZVS/ZCS isolated sine
amplitude converter
Actual size
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
100
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
°C
Transformation Module (VTM) operating
from a 48 Vdc bus to deliver an isolated
12 V secondary for Intermediate Bus
Architecture applications. The BCM may
be used to power non-isolated POL
converters or as an independent 12 V
source. Due to the fast response time and
low noise of the BCM, the need for
limited life aluminum electrolytic or
tantalum capacitors at the input of POL
converters is reduced—or eliminated—
resulting in savings of board area,
materials and total system cost.
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.3 to 7.0
-0.5 to 15.0
2250
TM to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Input to Output
T grade; See note 2
Continuous
-40 to 125
17.0
A
Peak output current
Case temperature during reflow
Storage temperature
Output power
25
A
For 1 ms
208
°C
-40 to 150
200
°C
W
Continuous
For 1 ms
Peak output power
300
W
The BCM achieves a power density of
800 W/in3 and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power package is
compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
Thermal Resistance
Symbol
RθJC
Parameter
Typ
1.1
2.1
6.5
5.0
Max
Units
°C/W
°C/W
°C/W
°C/W
Junction-to-case
Junction-to-BGA
Junction-to-ambient3
Junction-to-ambient4
1.5
2.5
7.2
5.5
RθJB
RθJA
RθJA
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T20 (0.25"H optional Pin Fins) surface mounted on FR4 board, 300 LFM.
Vicor Corporation
Tel: 800-735-6200
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 1 of 16
45
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