Datasheet > VD55G0

VD55G0

更新时间： 2023-12-20 18:45:57

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
3页	2571K
描述
Consumer Global Shutter 0.4Mp

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VD55G0 数据手册

VD55G0

Data brief

Advanced 640 x 600 pixel, backside illuminated global shutter, ultra compact

sensor, with high QE, high MTF, excellent PLS, and full-features

Features

•

Global shutter technology, ST proprietary single layer

3D stacked sensor 40 nm/65 nm

2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)

High performance with excellent

–

QE (quantum efficiency)

MTF (modulation transfer function) up to near IR

Perfect PLS (shutter efficiency)

•

Smallest sensor on market with:

–

Compact die size: 2.6 mm x 2.5 mm

640 pixel x 600 pixel resolution

Very small pixel array, 1.67 mm x 1.57 mm

Optical format between 1/9 inch

Order code

Description

•

Operating junction temperature: -30°C to 85°C

Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3,

1.2 Gbps per lane

VD55G0

Bare die

Application

•

Fast mode+ I2C control interface

Integrated temperature sensor

Engineered for high-performance

computer vision applications, including

AR/VR, personal and industrial robotics,

drones, barcodes, biometrics and

gestures, embedded vision or scene

recognition.

Up to 210 fps (frames per second) at full resolution and 260 fps with VGA

resolution

•

Programmable sequences of 4-frame contexts, including frame parameters

Automatic dark calibration

Dynamic defective correction

Typical use cases where high-

performance near IR sensing is key. Also

demanding computer vision on scene with

movement requiring no shutter artifacts.

Embedded auto-exposure

4 multiple function IO, dynamically programmable with frame contexts (GPIO,

strobe pulse, pulse-width modulation, V sync)

•

Up to 4 illumination control outputs, synchronized with sensor integration periods

and master/slave external frame start

•

Mirror/flip readout

Fully sequenceable with frame contexts

Crop

Binning (x2 and x4)

Analog binning: 320x240 @ 500fps, 320x252 @ 480fps, 320x300 @ 414 fps

Sub sampling (x2 and x4)

Description

The VD55G0 is a global shutter image sensor with high BSI performance which

captures up to 210 frames per second in a 644 x 604 resolution format. The

pixel construction of this device minimizes crosstalk while enabling a high quantum

efficiency (QE) in the near infrared spectrum.

DB4129 - Rev 4 - January 2022

www.st.com

For further information contact your local STMicroelectronics sales office.

12 3

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