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V62/12621-01XE-T PDF预览

V62/12621-01XE-T

更新时间： 2024-11-18 11:06:19
品牌 Logo 应用领域
德州仪器 - TI 控制器微控制器光电二极管外围集成电路装置闪存
页数 文件大小 规格书
43页 620K
描述
具有 2KB 闪存和 128B RAM 的增强型 16 位超低功耗混合信号微控制器 | PW | 14 | -40 to 125

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V62/12621-01XE-T 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：TSSOP-14针数：14
Reach Compliance Code：compliantHTS代码：8542.31.00.01
Factory Lead Time：6 weeks风险等级：5.76
Samacsys Description：16-bit Microcontrollers - MCU EP 16B Ultra-Lo-Pwr Mixed Signal MCU具有ADC：YES
地址总线宽度：位大小：16
边界扫描：YESDAC 通道：NO
DMA 通道：YES外部数据总线宽度：
格式：FIXED POINT集成缓存：NO
JESD-30 代码：R-PDSO-G14JESD-609代码：e4
长度：5 mm低功率模式：YES
湿度敏感等级：3DMA 通道数量：1
外部中断装置数量：I/O 线路数量：10
串行 I/O 数：端子数量：14
计时器数量：1片上数据RAM宽度：8
片上程序ROM宽度：8最高工作温度：125 °C
最低工作温度：-40 °CPWM 通道：NO
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
RAM（字节）：128RAM（字数）：0.125
ROM（单词）：3072ROM可编程性：FLASH
座面最大高度：1.2 mm速度：16 MHz
最大压摆率：0.39 mA最大供电电压：3.6 V
最小供电电压：1.8 V标称供电电压：2.2 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL宽度：4.4 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

V62/12621-01XE-T 数据手册

 浏览型号V62/12621-01XE-T的Datasheet PDF文件第2页浏览型号V62/12621-01XE-T的Datasheet PDF文件第3页浏览型号V62/12621-01XE-T的Datasheet PDF文件第4页浏览型号V62/12621-01XE-T的Datasheet PDF文件第5页浏览型号V62/12621-01XE-T的Datasheet PDF文件第6页浏览型号V62/12621-01XE-T的Datasheet PDF文件第7页 
MSP430G2231-EP  
www.ti.com  
SLAS862 –JUNE 2012  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
•
Low Supply-Voltage Range: 1.8 V to 3.6 V  
•
On-Chip Emulation Logic With Spy-Bi-Wire  
Interface  
•
Ultra-Low Power Consumption  
•
•
For Family Members Details, See Table 1 and  
–
–
–
Active Mode: 220 µA at 1 MHz, 2.2 V  
Standby Mode: 0.5 µA  
Available in a 14-Pin Plastic Small-Outline Thin  
Package (TSSOP) (PW)  
Off Mode (RAM Retention): 0.1 µA  
•
For Complete Module Descriptions, See the  
MSP430x2xx Family User’s Guide (SLAU144)  
•
•
Five Power-Saving Modes  
Ultra-Fast Wake-Up From Standby Mode in  
Less Than 1 µs  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
•
•
16-Bit RISC Architecture, 62.5-ns Instruction  
Cycle Time  
•
•
•
•
Controlled Baseline  
Basic Clock Module Configurations  
One Assembly/Test Site  
One Fabrication Site  
–
Internal Frequencies up to 16 MHz With  
One Calibrated Frequency  
Available in Extended (–40°C/125°C)  
–
Internal Very Low Power Low-Frequency  
(LF) Oscillator  
(2)  
Temperature Range  
•
•
•
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
(1)  
–
–
32-kHz Crystal  
External Digital Clock Source  
•
•
16-Bit Timer_A With Two Capture/Compare  
Registers  
Universal Serial Interface (USI) Supporting SPI  
and I2C (See Table 1)  
•
•
Brownout Detector  
10-Bit 200-ksps A/D Converter With Internal  
Reference, Sample-and-Hold, and Autoscan  
(See Table 1)  
•
Serial Onboard Programming,  
No External Programming Voltage Needed,  
Programmable Code Protection by Security  
Fuse  
(1) Crystal oscillator cannot be operated beyond 105°C  
(2) Custom temperature ranges available  
DESCRIPTION  
The MSP430G2231 is an ultra-low-power microcontroller consisting of several devices featuring different sets of  
peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized  
to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit  
RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally  
controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.  
The MSP430G2231 has a 10-bit A/D converter and built-in communication capability using synchronous  
protocols (SPI or I2C). For configuration details, see Table 1.  
Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values,  
and then process the data for display or for transmission to a host system.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...43

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