是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | LFQFP, QFP64,.47SQ,20 | 针数: | 64 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.77 |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ |
地址总线宽度: | 位大小: | 16 | |
边界扫描: | YES | CPU系列: | MSP430 |
最大时钟频率: | 16 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
格式: | FIXED POINT | 集成缓存: | NO |
JESD-30 代码: | S-PQFP-G64 | JESD-609代码: | e4 |
长度: | 10 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | DMA 通道数量: | |
外部中断装置数量: | I/O 线路数量: | 48 | |
串行 I/O 数: | 4 | 端子数量: | 64 |
计时器数量: | 8 | 片上数据RAM宽度: | 8 |
片上程序ROM宽度: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFQFP |
封装等效代码: | QFP64,.47SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 2048 | RAM(字数): | 2 |
ROM(单词): | 61440 | ROM可编程性: | FLASH |
座面最大高度: | 1.6 mm | 速度: | 16 MHz |
子类别: | Microcontrollers | 最大压摆率: | 0.449 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 2.2 V |
标称供电电压: | 2.7 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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