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Datasheet > 驱动程序和接口 > 线路驱动器或接收器> V62/06642-01XE
V62/06642-01XE PDF预览

V62/06642-01XE

更新时间： 2024-10-01 12:47:19
品牌 Logo 应用领域
德州仪器 - TI 线路驱动器或接收器驱动程序和接口接口集成电路光电二极管
页数 文件大小 规格书
15页 360K
描述
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION

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V62/06642-01XE 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：GREEN, PLASTIC, SSOP-16针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：5.14Is Samacsys：N
差分输出：NO驱动器位数：1
高电平输入电流最大值：0.000001 A输入特性：SCHMITT TRIGGER
接口集成电路类型：LINE TRANSCEIVER接口标准：EIA-232-F; TIA-232-F; V.28
JESD-30 代码：R-PDSO-G16JESD-609代码：e4
长度：6.2 mm湿度敏感等级：1
功能数量：1端子数量：16
最高工作温度：125 °C最低工作温度：-55 °C
最小输出摆幅：10 V最大输出低电流：0.000001 A
输出极性：INVERTED封装主体材料：PLASTIC/EPOXY
封装代码：SSOP封装等效代码：SSOP16,.3
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：260电源：3.3/5 V
认证状态：Not Qualified最大接收延迟：150 ns
接收器位数：1座面最大高度：2 mm
子类别：Line Driver or Receivers最大压摆率：1 mA
最大供电电压：3.6 V最小供电电压：3 V
标称供电电压：3.3 V电源电压1-最大：5.5 V
电源电压1-分钟：4.5 V电源电压1-Nom：5 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
最大传输延迟：150 ns宽度：5.3 mm
Base Number Matches：1

V62/06642-01XE 数据手册

 浏览型号V62/06642-01XE的Datasheet PDF文件第2页浏览型号V62/06642-01XE的Datasheet PDF文件第3页浏览型号V62/06642-01XE的Datasheet PDF文件第4页浏览型号V62/06642-01XE的Datasheet PDF文件第5页浏览型号V62/06642-01XE的Datasheet PDF文件第6页浏览型号V62/06642-01XE的Datasheet PDF文件第7页 
MAX3221-EP  
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS751–OCTOBER 2006  
FEATURES  
•
Controlled Baseline  
•
Auto-Powerdown Feature Automatically  
Disables Drivers for Power Savings  
– One Assembly/Test Site, One Fabrication  
Site  
APPLICATIONS  
•
•
•
Extended Temperature Performance of –55°C  
to 125°C  
Battery-Powered, Hand-Held, and Portable  
Equipment  
PDAs and Palmtop PCs  
Notebooks, Subnotebooks, and Laptops  
Digital Cameras  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
•
•
•
•
•
•
•
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
Mobile Phones and Wireless Devices  
RS-232 Bus-Pin ESD Protection Exceeds  
±15 kV Using Human-Body Model (HBM)  
DB PACKAGE  
(TOP VIEW)  
•
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
EN  
C1+  
V+  
FORCEOFF  
1
2
3
4
5
6
7
8
16  
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply  
Operates up to 250 kbit/s  
15 VCC  
14 GND  
One Driver and One Receiver  
C1-  
C2+  
C2-  
V-  
DOUT  
13  
12 FORCEON  
Low Standby Current . . . 1 µA Typical  
External Capacitors . . . 4 × 0.1 µF  
Accepts 5-V Logic Input With 3.3-V Supply  
11  
10  
9
DIN  
INVALID  
ROUT  
RIN  
Alternative High-Speed Pin-Compatible  
Device (1 Mbit/s)  
– SNx5C3221  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION/ORDERING INFORMATION  
The MAX3221 consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV ESD  
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of  
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the  
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to  
5.5-V supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver  
output slew rate.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
MB3221M  
–55°C to 125°C  
SSOP – DB  
Reel of 2000  
MAX3221MDBREP  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...15

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