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V62/06621-01XE

更新时间： 2024-11-04 12:47:19
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
15页 503K
描述
SINGLE SCHMITT-TRIGGER BUFFER

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V62/06621-01XE 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOT-23
包装说明：LSSOP, TSOP5/6,.11,37针数：5
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：5.3系列：LVC/LCX/Z
JESD-30 代码：R-PDSO-G5JESD-609代码：e4
长度：2.9 mm负载电容（CL）：50 pF
逻辑集成电路类型：BUFFER最大I（ol）：0.032 A
湿度敏感等级：1功能数量：1
输入次数：1端子数量：5
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：LSSOP
封装等效代码：TSOP5/6,.11,37封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：3.3 V
最大电源电流（ICC）：0.01 mAProp。Delay @ Nom-Sup：5.5 ns
传播延迟（tpd）：11 ns认证状态：Not Qualified
施密特触发器：YES座面最大高度：1.45 mm
子类别：Gates最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：3.3 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.95 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：1.6 mm

V62/06621-01XE 数据手册

 浏览型号V62/06621-01XE的Datasheet PDF文件第2页浏览型号V62/06621-01XE的Datasheet PDF文件第3页浏览型号V62/06621-01XE的Datasheet PDF文件第4页浏览型号V62/06621-01XE的Datasheet PDF文件第5页浏览型号V62/06621-01XE的Datasheet PDF文件第6页浏览型号V62/06621-01XE的Datasheet PDF文件第7页 
SN74LVC1G17-EP  
www.ti.com  
SGLS336A–APRIL 2006–REVISED JUNE 2007  
SINGLE SCHMITT-TRIGGER BUFFER  
FEATURES  
•
ESD Protection Exceeds JESD 22  
•
Controlled Baseline  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
–
One Assembly/Test Site, One Fabrication  
Site  
1000-V Charged-Device Model (C101)  
(1)  
•
•
Extended Temperature Performance of –55°C  
to 125°C  
Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Qualification Pedigree(1)  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Max tpd of 4.6 ns at 3.3 V  
DCK PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
Low Power Consumption, 10 μA Max ICC  
±24 mA Output Drive at 3.3 V  
NC  
VCC  
1
2
3
5
1
2
3
5
VCC  
NC  
A
Ioff Supports Partial Power Down Mode  
Operation  
A
4
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
GND  
Y
4
Y
GND  
DESCRIPTION/ORDERING INFORMATION  
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an  
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going  
(VT+) and negative-going (VT–) signals.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
SOT (SC-70) - DCK  
SOP (SOT-23) - DBV  
ORDERABLE PART NUMBER  
SN74LVC1G17MDCKREP  
SN74LVC1G17MDBVREP  
TOP-SIDE MARKING  
Reel of 3000  
Reel of 3000  
C70  
–55°C to 125°C  
C170  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
INPUT A  
OUTPUT Y  
H
L
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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