生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 27 X 27 MM, PLASTIC, BGA-272 | 针数: | 272 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.23 | Is Samacsys: | N |
其他特性: | ALSO REQUIRES 3.3V SUPPLY | 地址总线宽度: | 22 |
桶式移位器: | NO | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 200 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PBGA-B272 | JESD-609代码: | e0 |
长度: | 27 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | DMA 通道数量: | 16 |
外部中断装置数量: | 4 | 端子数量: | 272 |
计时器数量: | 2 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA272,20X20,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 220 | 电源: | 1.2,3.3 V |
认证状态: | Not Qualified | RAM(字数): | 4096 |
座面最大高度: | 2.57 mm | 子类别: | Digital Signal Processors |
最大供电电压: | 1.32 V | 最小供电电压: | 1.14 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 27 mm |
uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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PRECISION PROGRAMMABLE REFERENCE |