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V62/04672-01XE PDF预览

V62/04672-01XE

更新时间: 2024-09-29 12:55:35
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
9页 433K
描述
3.3-V ABT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

V62/04672-01XE 数据手册

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢃ ꢉꢊ ꢋꢌ  
ꢍ ꢎꢍ ꢊꢅ ꢏꢐꢆ ꢑ ꢒꢆꢏꢄ ꢐꢓꢔ ꢔ ꢋꢕ ꢖꢗ ꢕ ꢘꢅ ꢋ ꢕ  
ꢙ ꢘꢆ ꢇ ꢍ ꢊꢀꢆꢏꢆ ꢋ ꢑ ꢓꢆ ꢌꢓ ꢆꢀ  
SCBS766 − NOVEMBER 2003  
D
D
D
D
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
D
D
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
Enhanced Product-Change Notification  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
Qualification Pedigree  
Supports Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
PW PACKAGE  
(TOP VIEW)  
3.3-V V  
)
CC  
D
D
D
Supports Unregulated Battery Operation  
Down to 2.7 V  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
19 2OE  
18 1Y1  
1
2
3
4
5
6
7
8
9
10  
20  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
A
17  
16  
15  
14  
13  
12  
11  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
I
and Power-Up 3-State Support Hot  
off  
Insertion  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
description/ordering information  
This octal buffer and line driver is designed specifically for low-voltage (3.3-V) V  
capability to provide a TTL interface to a 5-V system environment.  
operation, but with the  
CC  
This device is organized as two 4-bit buffer/line drivers with separate output-enable (OE) inputs. When OE is  
low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors  
with the bus-hold circuitry is not recommended.  
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the device when it is powered down. The  
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
PACKAGE  
TSSOP − PW  
A
−40°C to 85°C  
Tape and reel SN74LVTH240IPWREP LH240EP  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢆꢥ  
Copyright 2003, Texas Instruments Incorporated  
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢮ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢎ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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