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V62/03619-07ZE PDF预览

V62/03619-07ZE

更新时间： 2024-11-24 12:16:59
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管输出元件输入元件
页数 文件大小 规格书
33页 866K
描述
FAMILY OF LOW-POWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPPLIFIERS WITH SHUTDOWN

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V62/03619-07ZE 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：GREEN, TSSOP-14针数：14
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：20 weeks
风险等级：5.36Is Samacsys：N
放大器类型：OPERATIONAL AMPLIFIER架构：VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：0.014 µA25C 时的最大偏置电流 (IIB)：0.014 µA
最小共模抑制比：71 dB标称共模抑制比：85 dB
频率补偿：YES最大输入失调电流 (IIO)：1700 µA
最大输入失调电压：1500 µVJESD-30 代码：R-PDSO-G14
JESD-609代码：e4长度：5 mm
低-偏置：NO低-失调：NO
微功率：NO湿度敏感等级：1
功能数量：4端子数量：14
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP14,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：260功率：NO
电源：+-1.35/+-3/2.7/6 V可编程功率：NO
认证状态：Not Qualified座面最大高度：1.2 mm
最小摆率：0.8 V/us标称压摆率：1.6 V/us
子类别：Operational Amplifier最大压摆率：0.65 mA
供电电压上限：6 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
标称均一增益带宽：6400 kHz最小电压增益：31622
宽带：NO宽度：4.4 mm
Base Number Matches：1

V62/03619-07ZE 数据手册

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SGLS132C − AUGUST 2002 − REVISED OCTOBER 2005  
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
D
D
D
D
Supply Current . . . 500 µA/channel  
Input Offset Voltage . . . 100 µV  
Input Noise Voltage . . . 11 nV/√Hz  
Slew Rate . . . 1.6 V/µs  
Micropower Shutdown Mode  
(TLV2460/3) . . . 0.3 µA/Channel  
D
D
Extended Temperature Performance of  
−55°C to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
D
Universal Operational Amplifier EVM  
D
D
D
D
D
Enhanced Product Change Notification  
†
Qualification Pedigree  
TLV2460  
D PACKAGE  
(TOP VIEW)  
Rail-to-Rail Output Swing  
Gain Bandwidth Product . . . 6.4 MHz  
80 mA Output Drive Capability  
NC  
IN−  
SHDN  
1
2
3
4
8
7
6
5
†
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
V
+
DD  
IN+  
OUT  
NC  
GND  
description  
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for  
portable applications. The input common-mode voltage range extends beyond the supply rails for maximum  
dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive  
capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail  
dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.  
The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current,  
providing good ac performance with low power consumption. Devices are available with an optional shutdown  
terminal, which places the amplifier in an ultralow supply current mode (I  
the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with  
= 0.3 µA/ch). While in shutdown,  
DD  
an input noise voltage of 11 nV/√Hz and input offset voltage of 100 µV.  
†
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
‡
PACKAGE  
T
A
D
D
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
TLV2462AQDREP  
TLV2463AQDREP  
TLV2462AMDREP  
TLV2464AMDREP  
TLV2464AMPWREP  
2462AE  
−40°C to 125°C  
−55°C to 125°C  
V2463AQE  
2462AM  
D
D
V2464AME  
2464AME  
PW  
†
‡
Some of the TLV246x family, along with packaging options, are in the Product Preview stage of  
development. Contact the local Texas Instruments sales office for availability.  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
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Copyright 2005, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...33

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