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V62/03607-02XE

更新时间： 2024-11-10 11:07:59
品牌 Logo 应用领域
德州仪器 - TI 驱动总线驱动器总线收发器
页数 文件大小 规格书
14页 608K
描述
具有三态输出的增强型产品 8 通道、2V 至 6V 缓冲器 | DW | 20 | -40 to 125

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V62/03607-02XE 数据手册

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SCLS463A − JULY 2002 − REVISED JANUARY 2004  
DW OR PW PACKAGE  
(TOP VIEW)  
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
V
CC  
2OE  
1
2
3
4
5
6
7
8
9
10  
20  
19  
D
D
D
D
D
Extended Temperature Performance of Up  
To −55°C to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
18 1Y1  
17 2A4  
16  
15  
14  
13  
12  
11  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
Enhanced Product-Change Notification  
†
Qualification Pedigree  
3-State Outputs Drive Bus Lines or Buffer  
Memory Address Registers  
GND  
D
High-Current Outputs Drive Up To 15  
LSTTL Loads  
†
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life.  
description/ordering information  
This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state  
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74HC244 is  
organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device  
passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
‡
PACKAGE  
T
A
SOP − DW  
TSSOP − PW  
SOP − DW  
Tape and reel  
Tape and reel  
Tape and reel  
SN74HC244QDWREP  
SN74HC244QPWREP  
SN74HC244MDWREP  
SHC244EP  
−40°C to 125°C  
−55°C to 125°C  
SHC244EP  
HC244MEP  
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
FUNCTION TABLE  
(each buffer/driver)  
INPUTS  
OUTPUT  
Y
OE  
A
H
L
L
L
H
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...14

中文翻译

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