Datasheet > V5PA22

V5PA22

更新时间： 2023-12-06 20:01:58

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
5页	150K
描述
Surface-Mount TMBS? (Trench MOS Barrier Schottky) Rectifier

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V5PA22 数据手册

V5PA22

Vishay General Semiconductor

www.vishay.com

Surface-Mount TMBS^®(Trench MOS Barrier Schottky) Rectifier

FEATURES

eSMP^®Series

Available

• Very low profile - typical height of 0.95 mm

• Trench MOS Schottky technology

• Low power losses, high efficiency

• Low forward voltage drop

• Meets MSL level 1, per J-STD-020,

LF maximum peak of 260 °C

Top View

Bottom View

• AEC-Q101 qualified available

SMPA (DO-221BC)

- Automotive ordering code: P/NHM3

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Anode

Cathode

TYPICAL APPLICATIONS

LINKS TO ADDITIONAL RESOURCES

For use in high frequency inverters, freewheeling, DC/DC

converters, and polarity protection in commercial and

automotive applications.

3D Models

MECHANICAL DATA

Case: SMPA (DO-221BC)

PRIMARY CHARACTERISTICS

Molding compound meets UL 94 V-0 flammability rating

Base P/N-M3 - halogen-free, RoHS-compliant

Base P/NHM3_X - halogen-free, RoHS-compliant, and

AEC-Q101 qualified

I_F(AV)

5.0 A

200 V

90 A

V_RRM

I_FSM

V_Fat I_F= 5.0 A (T_A= 125 °C)

T_Jmax.

0.69 V

175 °C

(“_X” denotes revision code e.g. A, B,.....)

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD22-B102

M3 and HM3 suffix meets JESD 201 class 2 whisker test

Package

SMPA (DO-221BC)

Single

Circuit configuration

Polarity: color band denotes cathode end

MAXIMUM RATINGS (T_A= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

V5PA22

V522

200

UNIT

Device marking code

Maximum repetitive peak reverse voltage

V_RRM

(1)

I_F(AV)

5.0

Maximum DC forward current

(2)

I_F(AV)

2.3

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load

I_FSM

(3)

Operating junction temperature range

Storage temperature range

T_J

-40 to +175

°C

T_STG

Notes

(1)

(2)

(3)

Mounted on 3 cm x 3 cm copper pad area PCB

Free air, mounted on recommended copper pad area

The heat generated must be less than the thermal conductivity from junction-to-ambient: dP_D/dT_J< 1/R_θJA

Revision: 20-Apr-2023

Document Number: 87472

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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