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V58C265404S PDF预览

V58C265404S

更新时间: 2024-11-27 22:36:59
品牌 Logo 应用领域
MOSEL 动态存储器双倍数据速率
页数 文件大小 规格书
44页 392K
描述
HIGH PERFORMANCE 2.5 VOLT 16M X 4 DDR SDRAM 4 BANKS X 4Mbit X 4

V58C265404S 数据手册

 浏览型号V58C265404S的Datasheet PDF文件第2页浏览型号V58C265404S的Datasheet PDF文件第3页浏览型号V58C265404S的Datasheet PDF文件第4页浏览型号V58C265404S的Datasheet PDF文件第5页浏览型号V58C265404S的Datasheet PDF文件第6页浏览型号V58C265404S的Datasheet PDF文件第7页 
V58C265404S  
PRELIMINARY  
MOSEL VITELIC  
HIGH PERFORMANCE  
2.5 VOLT 16M X 4 DDR SDRAM  
4 BANKS X 4Mbit X 4  
6
166 MHz  
6 ns  
7
8
System Frequency (f  
)
143 MHz  
7 ns  
125 MHz  
8 ns  
CK  
Clock Cycle Time (t  
Clock Cycle Time (t  
Clock Cycle Time (t  
)
CK3  
)
6.5 ns  
7ns  
7.5 ns  
8ns  
9 ns  
CK2.5  
)
10ns  
CK2  
Features  
Description  
4 banks x 4Mbit x 4 organization  
High speed data transfer rates with system  
frequency up to 166 MHz  
The V58C265404S is a four bank DDR DRAM or-  
ganized as 4 banks x 4Mbit x 4. The V58C265404S  
achieves high speed data transfer rates by employ-  
ing a chip architecture that prefetches multiple bits  
and then synchronizes the output data to a system  
clock  
Data Mask for Write Control (DM)  
Four Banks controlled by BA0 & BA1  
Programmable CAS Latency: 2, 2.5, 3  
Programmable Wrap Sequence: Sequential  
or Interleave  
All of the control, address, circuits are synchro-  
nized with the positive edge of an externally sup-  
plied clock. I/O transactions are possible on both  
edges of DQS.  
Programmable Burst Length:  
2, 4, 8 for Sequential Type  
2, 4, 8 for Interleave Type  
Operating the four memory banks in an inter-  
leaved fashion allows random access operation to  
occur at a higher rate than is possible with standard  
DRAMs. A sequential and gapless data rate is pos-  
sible depending on burst length, CAS latency and  
speed grade of the device.  
Automatic and Controlled Precharge Command  
Suspend Mode and Power Down Mode  
Auto Refresh and Self Refresh  
Refresh Interval: 4096 cycles/64 ms  
Available in 66-pin 400 mil TSOP-II  
SSTL-2 Compatible I/Os  
Double Data Rate (DDR)  
Bidirectional Data Strobe (DQs) for input and  
output data, active on both edges  
On-Chip DLL aligns DQ and DQs transitions with  
CLK transitions  
Differential clock inputs CLK and CLK  
Power supply 2.5V ± 0.2V  
Device Usage Chart  
Operating  
Temperature  
Range  
Package Outline  
CLK Cycle Time (ns)  
Power  
Temperature  
Mark  
JEDEC 66 TSOPII  
–6  
-7  
-8  
Std.  
L
0°C to 70 °C  
Blank  
V58C265404S Rev. 1.4 January 2000  
1

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