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V58C2128

更新时间: 2024-11-24 22:24:27
品牌 Logo 应用领域
MOSEL 动态存储器双倍数据速率
页数 文件大小 规格书
59页 922K
描述
HIGH PERFORMANCE 2.5 VOLT 128 Mbit DDR SDRAM

V58C2128 数据手册

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V58C2128(804/404/164)S  
HIGH PERFORMANCE  
PRELIMINARY  
2.5 VOLT 128 Mbit DDR SDRAM  
4 BANKS X 4Mbit X 8 (804)  
4 BANKS X 2Mbit X 16 (164)  
4 BANKS X 8Mbit X 4 (404)  
6
7
75  
8
DDR333B  
7.5 ns  
DDR266A  
7.5ns  
DDR266B  
10 ns  
DDR200  
10 ns  
Clock Cycle Time (tCK2  
)
Clock Cycle Time (tCK2.5  
)
6 ns  
7ns  
7.5 ns  
8 ns  
System Frequency (fCK max  
)
167 MHz  
143 MHz  
133 MHz  
125 MHz  
Features  
Description  
The V58C2128(804/404/164)S is a four bank  
High speed data transfer rates with system  
frequency up to 166 MHz  
DDR DRAM organized as 4 banks x 4Mbit x 8 (804),  
4 banks x 2Mbit x 16 (404), or 4 banks x 8Mbit x 4  
(164). The V58C2128(804/404/164)S achieves high  
speed data transfer rates by employing a chip archi-  
tecture that prefetches multiple bits and then syn-  
chronizes the output data to a system clock.  
All of the control, address, circuits are synchro-  
nized with the positive edge of an externally sup-  
plied clock. I/O transactions are ocurring on both  
edges of DQS.  
Operating the four memory banks in an inter-  
leaved fashion allows random access operation to  
occur at a higher rate than is possible with standard  
DRAMs. A sequential and gapless data rate is pos-  
sible depending on burst length, CAS latency and  
speed grade of the device.  
Data Mask for Write Control  
Four Banks controlled by BA0 & BA1  
Programmable CAS Latency: 2, 2.5  
Programmable Wrap Sequence: Sequential  
or Interleave  
Programmable Burst Length:  
2, 4, 8 for Sequential Type  
2, 4, 8 for Interleave Type  
Automatic and Controlled Precharge Command  
Power Down Mode  
Auto Refresh and Self Refresh  
Refresh Interval: 4096 cycles/64 ms  
Available in 66-pin 400 mil TSOP  
SSTL-2 Compatible I/Os  
Double Data Rate (DDR)  
Bidirectional Data Strobe (DQS) for input and  
output data, active on both edges  
On-Chip DLL aligns DQ and DQs transitions with  
CK transitions  
Differential clock inputs CK and CK  
Power Supply 2.5V ± 0.2V  
QFC options for FET control. x4 parts.  
*Note: DDR 333B Supports PC2700 module with 2.5-3-3 timing  
DDR 266A Supports PC2100 module with 2-3-3 timing  
DDR 266B Supports PC2100 module with 2.5-3-3 timing  
DDR 200 Supports PC1600 module with 2-2-2 timing  
Device Usage Chart  
Operating  
Temperature  
Range  
Package Outline  
CK Cycle Time (ns)  
Power  
Std.  
Temperature  
Mark  
JEDEC 66 TSOP II  
-6  
-7  
-75  
-8  
L
0°C to 70°C  
Blank  
V58C2128(804/404/164)S Rev.1.6 March 2002  
1

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