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V2PL45L PDF预览

V2PL45L

更新时间: 2023-12-06 20:10:10
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
5页 103K
描述
Surface-Mount TMBS? (Trench MOS Barrier Schottky) Rectifier

V2PL45L 数据手册

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V2PL45L  
Vishay General Semiconductor  
www.vishay.com  
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier  
FEATURES  
• Low profile package  
eSMP® Series  
Available  
• Trench MOS Schottky technology  
• Low power losses, high efficiency  
• Low forward voltage drop  
• Meets MSL level 1, per J-STD-020, LF maximum  
peak of 260 °C  
• AEC-Q101 qualified available  
- Automotive ordering code; base P/NHM3  
SMP (DO-220AA)  
Cathode  
Anode  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
LINKS TO ADDITIONAL RESOURCES  
TYPICAL APPLICATIONS  
3
D
3
D
For use in low voltage, high frequency inverters,  
freewheeling, DC/DC converters, and polarity protection  
applications.  
3D Models  
PRIMARY CHARACTERISTICS  
MECHANICAL DATA  
Case: SMP (DO-220AA)  
Molding compound meets UL 94 V-0 flammability rating  
IF(AV)  
2.0 A  
45 V  
VRRM  
Base P/N-M3  
commercial grade  
Base P/NHM3  
AEC-Q101 qualified  
-
halogen-free, RoHS-compliant, and  
IFSM  
50 A  
VF at IF = 2.0 A  
TJ max.  
0.36 V  
150 °C  
- halogen-free, RoHS-compliant, and  
Package  
SMP (DO-220AA)  
Single  
Terminals: matte tin plated leads, solderable per  
J-STD-002 and JESD 22-B102  
Circuit configuration  
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix  
meets JESD 201 class 2 whisker test  
Polarity: color band denotes the cathode end  
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)  
PARAMETER  
SYMBOL  
V2PL45L  
UNIT  
Device marking code  
2LE  
45  
2
Maximum repetitive peak reverse voltage  
Maximum DC forward current  
VRRM  
V
A
(1)  
IF  
Peak forward surge current 10 ms single half sine-wave  
superimposed on rated load  
IFSM  
50  
A
(2)  
Operating junction and storage temperature range  
Operating junction and storage temperature range  
TJ  
-40 to +150  
-55 to +150  
°C  
°C  
TSTG  
Notes  
(1)  
Free air, mounted on recommended copper pad area  
The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA  
(2)  
Revision: 08-Mar-2022  
Document Number: 87459  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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