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UT8R128K32 PDF预览

UT8R128K32

更新时间: 2024-10-31 00:54:03
品牌 Logo 应用领域
艾法斯 - AEROFLEX 静态存储器
页数 文件大小 规格书
22页 274K
描述
UT8R128K32 128K x 32 SRAM

UT8R128K32 数据手册

 浏览型号UT8R128K32的Datasheet PDF文件第2页浏览型号UT8R128K32的Datasheet PDF文件第3页浏览型号UT8R128K32的Datasheet PDF文件第4页浏览型号UT8R128K32的Datasheet PDF文件第5页浏览型号UT8R128K32的Datasheet PDF文件第6页浏览型号UT8R128K32的Datasheet PDF文件第7页 
Standard Products  
UT8R128K32 128K x 32 SRAM  
Data Sheet  
March 2009  
www.aeroflex.com/memories  
FEATURES  
INTRODUCTION  
‰
‰
15ns maximum access time  
The UT8R128K32 is a high-performance CMOS static RAM  
organized as 131,072 words by 32 bits. Easy memory expansion  
is provided by active LOW and HIGH chip enables (E1, E2), an  
active LOW output enable (G), and three-state drivers. This  
device has a power-down feature that reduces power  
Asynchronous operation, functionally compatible with  
industry-standard 128K x 32 SRAMs  
‰
CMOS compatible inputs and output levels, three-state  
bidirectional data bus  
- I/O Voltage 3.3 volts, 1.8 volt core  
Operational environment:  
consumption by more than 90% when deselected.  
‰
Writing to the device is accomplished by taking chip enable one  
(E1) input LOW, chip enable two (E2) HIGH and write enable  
(W) input LOW. Data on the 32 I/O pins (DQ0 through DQ31)  
is then written into the location specified on the address pins  
(A0 through A16). Reading from the device is accomplished by  
taking chip enable one (E1) and output enable (G) LOW while  
forcing write enable(W) and chip enable two(E2) HIGH. Under  
these conditions, the contents of the memory location specified  
by the address pins will appear on the I/O pins.  
- Total-dose: 300 Krad(Si)  
2
- SEL Immune: >100 MeV-cm /mg  
2
- LET (0.25): 53.0 MeV-cm /mg  
th  
2
- Memory Cell Saturated Cross Section: 1.67E-7cm /bit  
- Neutron Fluence: 3.0E14n/cm  
2
- Dose Rate  
- Upset 1.0E9 rad(Si)/sec  
- Latchup >1.0E11 rad(Si)/sec  
Packaging options:  
‰
‰
The 32 input/output pins (DQ0 through DQ31) are placed in a  
high impedance state when the device is deselected (E1 HIGH  
or E2 LOW), the outputs are disabled (G HIGH), or during a  
write operation (E1 LOW, E2 HIGH and W LOW).  
- 68-lead ceramic quad flatpack (6.19 grams)  
Standard Microcircuit Drawing 5962-03236  
- QML Q & V compliant part  
W
A0  
Pre-Charge Circuit  
E1  
A1  
E2  
A2  
Memory Array  
256K x 16  
HHWE  
A3  
A4  
LHWE  
A5  
A6  
A7  
A8  
I/O Circuit  
G
A9  
Column Select  
Low Word  
Read Circuit  
DQ(15) to DQ(0)  
DQ(31) to DQ(16)  
Data Control  
Data Control  
A10 A11 A12 A13A14 A15 A16  
High Word  
Read Circuit  
Figure 1. UT8R128K32 SRAM Block Diagram  
1

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