Datasheet > UT230-80

UT230-80

更新时间： 2024-11-06 01:21:07

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MARKTECH		/
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LEDs

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UT230-80 数据手册

UltraThin™ LEDs

CxxxUT230-S0ꢀ00

Cree’s UltraThin LEDs combine highly efﬁcient InGaN materials with Cree’s proprietary G•SiC^®substrate to deliver

superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low

forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical speciﬁcations and the

ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner

form factors are required.

FEATURES

APPLICATIONS

•

Small Chip – 230 x 230 x 85 μm

Low Forward Voltage

3.3V Typical at 20 mA

UT LED Performance

8.0 mW min. (455–475 nm) Blue

•

Mobile Phone Keypads

–

White LEDs

Blue LEDs

–

•

Audio Product Display Lighting

Mobile Appliance Keypads

–

•

Single Wire Bond Structure

Class 2 ESD Rating

CxxxUT230-S0ꢀ00 Chip Diagram

Top View

Bottom View

Die Cross Section

SiC Substrate

Bottom Surface

150 x 150 μm

G•SiC LED Chip

230 x 230 μm

InGaN

Anode (+)

Mesa (junction)

176 x 176 μm

SiC Substrate

h = 85 μm

Gold Bond Pad

105 μm Diameter

Backside

Metallization

80 x 80 μm

Cathode (-)

Subject to change without notice.

www.cree.com

ꢀ

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