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Features
• Halogen Free. “Green” Device (Note 1)
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High Efficient
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• Low Profile Package
• Ideal for Automated Placement
• Glass Passivated Chip Junction
• High Forward Surge Capability
• Super Fast Reverse Recovery Time
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Maximum Ratings
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• 6WRUDJHꢄ7HPSHUDWXUHꢄ5DQJHꢎꢄꢏꢉꢉ⁰C to +1ꢉꢆ⁰C
• Typicalꢄ7KHUPDOꢄ5HVLVWDQFH(Note 3)ꢋ15ꢄ&ꢂ:ꢄ-XQFWLRQꢄWRꢄCase
• Typical Thermal Resistance(Note 3): 20°C/W Junction to Lead
• Typical Thermal Resistance(Note 3): 60°C/W Junction to Ambient
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DIMENSIONS
MM
MIN MAX MIN MAX
0.134 0.150 3.40 3.80
0.075 0.083 1.90 2.10
0.163 0.175 4.15 4.45
0.201 0.220 5.10 5.60
0.041 0.061 1.05 1.55
0.028 0.053 0.70 1.35
0.006 0.010 0.15 0.25
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1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
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3. Mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas.
Rev.3-1-10012021
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