US1A - US1M
D A Y A
- TDD-
1.0 Amps. Surface Mount High Efficient Rectifiers
SMA/DO-214AC
Features
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Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Ultrafast recovery time for high efficiency
Low forward voltage, low power loss
High temperature soldering guaranteed:
260oC/10 seconds on terminals
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Plastic material used carries Underwriters
Laboratory Classification 94V0
Mechanical Data
Dimensions in inches and (millimeters)
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Cases: Molded plastic
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Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity: Indicated by cathode band
Weight: 0.064 gram
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Maximum Ratings and Electrical Characteristics
Rating at 25oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol US1A US1B US1D US1G US1J US1K US1M Units
Maximum Recurrent Peak Reverse Voltage
VRRM
VRMS
VDC
50
35
50
100 200 400 600 800 1000
70 140 280 420 560 700
V
V
V
Maximum RMS Voltage
Maximum DC Blocking Voltage
100 200 400
00
800 1000
Maximum Average Forward Rectified Current
@ TL=110 oC
I(AV)
IFSM
1.0
A
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
30
Maximum Instantaneous Forward Voltage
@ 1.0A
VF
IR
1.0
1.7
V
Maximum DC Reverse Current
@ TA =25 oC at Rated DC Blocking Voltage
@ TA=125 oC
5.0
150
uA
uA
nS
Maximum Reverse Recovery Time ( Note 1 )
Trr
Cj
50
75
10
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
15
75
27
pF
R
θJA
oC/W
R
θJL
Operating Temperature Range
Storage Temperature Range
TJ
-55 to +150
-55 to + 150
oC
TSTG
oC
1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
2. Measured at 1 MHz and Applied VR=4.0 Volts
Notes:
3. P.C.B. Mounted on 0.2 x 0.2” (5.0 x 5.0mm) Copper Pad Area.
- 272 -
Factory Address: Taiguan Industrial zone, Yanjinyu Dongjin Rode No.1, XinXiang, HeNan, China