是否Rohs认证: | 符合 | 生命周期: | Not Recommended |
零件包装代码: | QFP | 包装说明: | LFQFP, QFP100,.63SQ,20 |
针数: | 100 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.45 |
具有ADC: | YES | 地址总线宽度: | 22 |
位大小: | 32 | CPU系列: | V850 |
最大时钟频率: | 20 MHz | DAC 通道: | NO |
DMA 通道: | YES | 外部数据总线宽度: | 16 |
JESD-30 代码: | S-PQFP-G100 | JESD-609代码: | e6 |
长度: | 14 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 83 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFQFP | 封装等效代码: | QFP100,.63SQ,20 |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE, FINE PITCH |
电源: | 3.3/5,5 V | 认证状态: | Not Qualified |
RAM(字节): | 16384 | ROM(单词): | 262144 |
ROM可编程性: | FLASH | 座面最大高度: | 1.6 mm |
速度: | 20 MHz | 子类别: | Microcontrollers |
最大压摆率: | 70 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 4 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | MOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Bismuth (Sn98Bi2) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 宽度: | 14 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD70F3033AYGF-3BA | NEC |
获取价格 |
V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS | |
UPD70F3033AYGF-3BA-A | NEC |
获取价格 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PQFP100, 14 X 20 MM, PLASTIC, QFP-100 | |
UPD70F3033AYGF-8EU | ETC |
获取价格 |
Microcontroller | |
UPD70F3033B | ETC |
获取价格 |
V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] | |
UPD70F3033BGC-8EU-A | RENESAS |
获取价格 |
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC | |
UPD70F3033BY | ETC |
获取价格 |
V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] | |
UPD70F3033BYGF-3BA-A | RENESAS |
获取价格 |
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC | |
UPD70F3035A | NEC |
获取价格 |
V850/SB2TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS | |
UPD70F3035AGC-8EU | NEC |
获取价格 |
V850/SB2TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS | |
UPD70F3035AGC-8EU-A | RENESAS |
获取价格 |
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC |