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UPC8211TK-E2-A PDF预览

UPC8211TK-E2-A

更新时间: 2024-10-14 19:46:35
品牌 Logo 应用领域
日电电子 - NEC 射频微波
页数 文件大小 规格书
11页 101K
描述
Narrow Band Low Power Amplifier, 1.50 X 1.33 MM, 0.55 MM HEIGHT, LEAD FREE, LEADLESS MINIMOLD PACKAGE-6

UPC8211TK-E2-A 技术参数

是否Rohs认证:符合生命周期:Transferred
Reach Compliance Code:compliant风险等级:5.66
Is Samacsys:N构造:COMPONENT
增益:15.5 dB最大输入功率 (CW):10 dBm
JESD-609代码:e6最高工作温度:85 °C
最低工作温度:-25 °C射频/微波设备类型:NARROW BAND LOW POWER
端子面层:Tin/Bismuth (Sn/Bi)Base Number Matches:1

UPC8211TK-E2-A 数据手册

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DATA SHEET  
BIPOLAR ANALOG INTEGRATED CIRCUIT  
µPC8211TK  
SiGe LOW NOISE AMPLIFIER  
FOR GPS/MOBILE COMMUNICATIONS  
DESCRIPTION  
The µPC8211TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for  
GPS and mobile communications.  
The package is 6-pin lead-less minimold, suitable for surface mount.  
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.  
FEATURES  
Low noise  
: NF = 1.3 dB TYP. @ VCC = 3.0 V  
: GP = 18.5 dB TYP. @ VCC = 3.0 V  
: ICC = 3.5 mA TYP. @ VCC = 3.0 V  
High gain  
Low current consumption  
Gain 1 dB compression output power : Po (1 dB) = 6.0 dBm @ VCC = 3.0 V  
Built-in power-save function  
High-density surface mounting  
: 6-pin lead-less minimold package (1.5 × 1.3 × 0.55 mm)  
APPLICATION  
Low noise amplifier for GPS and mobile communications  
ORDERING INFORMATION  
Part Number  
Order Number  
Package  
Marking  
6G  
Supplying Form  
µPC8211TK-E2 µPC8211TK-E2-A  
6-pin lead-less minimold  
(1511 PKG) (Pb-Free)Note  
• Embossed tape 8 mm wide  
• Pin 1, 6 face the perforation side of the tape  
• Qty 5 kpcs/reel  
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact  
your nearby sales office.  
Remark To order evaluation samples, contact your nearby sales office.  
Part number for sample order: µPC8211TK  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PU10426EJ04V0DS (4th edition)  
Date Published January 2006 CP(K)  
The mark  shows major revised points.  
Printed in Japan  
NEC Compound Semiconductor Devices, Ltd. 2003, 2006  

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