NEC's SILICON MMIC LOW
CURRENT AMPLIFIER
UPC8179TK
FOR MOBILE COMMUNICATIONS
FEATURES
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE TK
•
HIGH DENSITY SURFACE MOUNTING:
6 Pin Leadless Minimold Package (1.5 x 1.1 x 0.55 mm)
1.3 0.05
•
•
SUPPLY VOLTAGE:
VCC = 2.4 to 3.3 V
1.1 0.1
0.16 0.05
BOTTOM
HIGH EFFICIENCY:
PO(1dB) = +2.0 dBm TYP at f = 1.0 GHz
PO(1dB) = +0.5 dBm TYP at f = 1.9 GHz
PO(1dB) = +0.5 dBm TYP at f = 2.4 GHz
1
2
3
6
5
4
0.2 0.1
•
•
POWER GAIN:
0.9
GP = 13.5 dB TYP at f = 1.0 GHz
GP = 15.5 dB TYP at f = 1.9 GHz
GP = 16.0 dB TYP at f = 2.4 GHz
0.11 +0.10
0.55 0.03
-0.05
EXCELLENT ISOLATION:
ISL = 43 dB TYP at f = 1.0 GHz
ISL = 42 dB TYP at f = 1.9 GHz
ISL = 42 dB TYP at f = 2.4 GHz
DESCRIPTION
NEC's UPC8179TK is a silicon monolithic integrated circuit
designed as an amplifier for mobile communications. This IC
can realize low current consumption with external chip induc-
tor. The incorporation of a chip identical to the conventional 6-
pinsuperminimoldpackage(2.0x1.25x0.9mm)μPC8179TB
ina6-pinleadlessminimoldpackage(1.5x1.1x0.55mm)has
enabledareductioninmountingareaof50%. TheμPC8179TK
is ideally suited to replace the μPC8179TB for footprint reduc-
tion and increased design density. This IC is manufactured
using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process)
silicon bipolar process. This process uses direct silicon nitride
passivation film and gold electrodes. These materials can
protect the chip surface from pollution and prevent corrosion/
migration. Thus this IC has excellent performance uniformity
and reliability.
•
•
•
LOW CURRENT CONSUMPTION:
ICC = 4.0 mA TYP AT VCC = 3.0 V
OPERATING FREQUENCY:
0.1 to 2.4 GHz (Output port LC matching)
LIGHT WEIGHT:
3 mg
APPLICATION
• Buffer amplifiers for 0.1 to 2.4 GHz mobile communications
systems.
NEC's stringent quality assurance and test procedures assure
the highest performance. consistency and reliability.
ELECTRICAL CHARACTERISTICS,
(Unless otherwise specified, TA = +25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω, at LC matched Frequency)
PART NUMBER
UPC8179TK
PACKAGE OUTLINE
TK
TYP
4.0
SYMBOLS
ICC
PARAMETERS AND CONDITIONS
UNITS
mA
MIN
MAX
Circuit Current (no input signal)
2.9
5.4
GP
Power Gain,
f = 1.0 GHz, PIN = -30 dBm
f = 1.9 GHz, PIN = -30 dBm
f = 2.4 GHz, PIN = -30 dBm
dB
11.0
13.0
14.0
13.5
15.5
16.0
15.5
17.5
18.5
ISOL
P1dB
NF
Isolation,
f = 1.0 GHz, PIN = -30 dBm
f = 1.9 GHz, PIN = -30 dBm
f = 2.4 GHz, PIN = -30 dBm
dB
dBm
dB
39.0
37.0
37.0
43.0
42.0
42.0
–
–
–
Output Power at
1 dB gain
compression,
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
-0.5
-2.0
-3.0
2.0
0.5
0.5
–
–
–
Noise Figure,
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
–
–
–
5.0
5.0
5.0
6.5
6.5
6.5
RLIN
Input Return Loss,
(without matching
circuit)
f = 1.0 GHz, PIN = -30 dBm
f = 1.9 GHz, PIN = -30 dBm
f = 2.4 GHz, PIN = -30 dBm
dB
4.0
4.0
6.0
7.0
7.0
9.0
–
–
–