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UPC8179TB-E3 PDF预览

UPC8179TB-E3

更新时间: 2024-11-17 22:22:27
品牌 Logo 应用领域
日电电子 - NEC 射频和微波射频放大器微波放大器通信
页数 文件大小 规格书
28页 152K
描述
SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS

UPC8179TB-E3 技术参数

是否Rohs认证: 不符合生命周期:Transferred
Reach Compliance Code:compliant风险等级:5.67
Is Samacsys:N其他特性:HIGH RELIABILITY
特性阻抗:50 Ω构造:COMPONENT
增益:13 dB最大输入功率 (CW):5 dBm
JESD-609代码:e0最大工作频率:2400 MHz
最小工作频率:100 MHz最高工作温度:85 °C
最低工作温度:-40 °C射频/微波设备类型:WIDE BAND LOW POWER
端子面层:Tin/Lead (Sn/Pb)Base Number Matches:1

UPC8179TB-E3 数据手册

 浏览型号UPC8179TB-E3的Datasheet PDF文件第2页浏览型号UPC8179TB-E3的Datasheet PDF文件第3页浏览型号UPC8179TB-E3的Datasheet PDF文件第4页浏览型号UPC8179TB-E3的Datasheet PDF文件第5页浏览型号UPC8179TB-E3的Datasheet PDF文件第6页浏览型号UPC8179TB-E3的Datasheet PDF文件第7页 
DATA SHEET  
BIPOLAR ANALOG INTEGRATED CIRCUIT  
µPC8179TB  
SILICON MMIC LOW CURRENT AMPLIFIER  
FOR MOBILE COMMUNICATIONS  
DESCRIPTION  
The µPC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This  
IC can realize low current consumption with external chip inductor which can not be realized on internal 50  
wideband matched IC. This low current amplifier operates on 3.0 V.  
This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This  
process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface  
from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.  
FEATURES  
Low current consumption  
Supply voltage  
:
:
:
ICC = 4.0 mA TYP. @ VCC = 3.0 V  
VCC = 2.4 to 3.3 V  
High efficiency  
PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz  
PO (1 dB) = +1.5 dBm TYP. @ f = 1.9 GHz  
PO (1 dB) = +1.0 dBm TYP. @ f = 2.4 GHz  
GP = 13.5 dB TYP. @ f = 1.0 GHz  
GP = 15.5 dB TYP. @ f = 1.9 GHz  
GP = 15.5 dB TYP. @ f = 2.4 GHz  
ISL = 44 dB TYP. @ f = 1.0 GHz  
ISL = 42 dB TYP. @ f = 1.9 GHz  
ISL = 41 dB TYP. @ f = 2.4 GHz  
0.1 to 2.4 GHz (Output port LC matching)  
Power gain  
:
:
:
Excellent isolation  
Operating frequency  
High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)  
Light weight 7 mg (Standard value)  
:
APPLICATION  
Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system  
Caution Electro-static sensitive devices  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. P14730EJ2V0DS00 (2nd edition)  
Date Published August 2000 N CP(K)  
Printed in Japan  
©
2000  

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