5秒后页面跳转
UPC2762TB-E3 PDF预览

UPC2762TB-E3

更新时间: 2024-02-05 12:30:15
品牌 Logo 应用领域
日电电子 - NEC 射频和微波射频放大器微波放大器功率放大器输出元件通信
页数 文件大小 规格书
28页 232K
描述
3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

UPC2762TB-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:TSSOP6,.08
Reach Compliance Code:compliantFactory Lead Time:1 week
风险等级:5.68安装特点:SURFACE MOUNT
功能数量:1端子数量:6
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:TSSOP6,.08
电源:3 V子类别:RF/Microwave Amplifiers
最大压摆率:35 mA表面贴装:YES
Base Number Matches:1

UPC2762TB-E3 数据手册

 浏览型号UPC2762TB-E3的Datasheet PDF文件第2页浏览型号UPC2762TB-E3的Datasheet PDF文件第3页浏览型号UPC2762TB-E3的Datasheet PDF文件第4页浏览型号UPC2762TB-E3的Datasheet PDF文件第5页浏览型号UPC2762TB-E3的Datasheet PDF文件第6页浏览型号UPC2762TB-E3的Datasheet PDF文件第7页 
DATA SHEET  
BIPOLAR ANALOG INTEGRATED CIRCUITS  
µPC2762TB,µPC2763TB,µPC2771TB  
3 V, SUPER MINIMOLD SILICON MMIC  
MEDIUM OUTPUT POWER AMPLIFIER  
FOR MOBILE COMMUNICATIONS  
DESCRIPTION  
The µPC2762TB, µPC2763TB and µPC2771TB are silicon monolithic integrated circuits designed as amplifier for  
mobile communications. These ICs operate at 3 V. The medium output power is suitable for RF-TX of mobile  
communications system.  
These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses direct  
silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and  
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.  
FEATURES  
Supply voltage  
: VCC = 2.7 to 3.3 V  
Medium output power  
: µPC2762TB; PO(1 dB) = +8.0 dBm TYP. @ f = 0.9 GHz  
µPC2763TB; PO(1 dB) = +9.5 dBm TYP. @ f = 0.9 GHz  
µPC2771TB; PO(1 dB) = +11.5 dBm TYP. @ f = 0.9 GHz  
: µPC2762TB; GP = 13 dB TYP. @ f = 0.9 GHz  
µPC2763TB; GP = 20 dB TYP. @ f = 0.9 GHz  
µPC2771TB; GP = 21 dB TYP. @ f = 0.9 GHz  
Power gain  
Upper limit operating frequency : µPC2762TB; fu = 2.9 GHz TYP. @ 3dB Bandwidth  
µPC2763TB; fu = 2.7 GHz TYP. @ 3dB Bandwidth  
µPC2771TB; fu = 2.2 GHz TYP. @ 3dB Bandwidth  
High-density surface mounting  
: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)  
APPLICATIONS  
Buffer amplifiers for mobile telephones: µPC2762TB, µPC2763TB  
PA driver for PDC800M  
: µPC2771TB  
ORDERING INFORMATION  
Part Number  
µPC2762TB-E3  
µPC2763TB-E3  
µPC2771TB-E3  
Package  
6-pin super minimold  
Marking  
Supplying Form  
Embossed tape 8 mm wide.  
C1Z  
C2A  
C2H  
1, 2, 3 pins face the perforation side of the tape.  
Qty 3 kpcs/reel.  
Remark To order evaluation samples, please contact your local NEC sales office.  
Part number for sample order: µPC2762TB, µPB2763TB, µPC2771TB  
Caution Electro-static sensitive devices  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. P12710EJ3V0DS00 (3rd edition)  
Date Published February 2001 N CP(K)  
Printed in Japan  
The mark  
shows major revised points.  
©
1997, 2001  

与UPC2762TB-E3相关器件

型号 品牌 描述 获取价格 数据表
UPC2762TB-E3-A CEL 3 V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER

获取价格

UPC2762T-E3 NEC 3 V, WIDEBAND MEDIUM POWER SI MMIC AMPLIFIER

获取价格

UPC2763T NEC 3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

获取价格

UPC2763TB NEC 3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

获取价格

UPC2763TB CEL 3 V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER

获取价格

UPC2763TB-E3 NEC 3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

获取价格