3 V SUPER MINIMOLD L-BAND
SI MMIC DOWNCONVERTER
UPC2756TB
FEATURES
INTERNAL BLOCK DIAGRAM
•
HIGH DENSITY SURFACE MOUNTING:
6 Pin Super Minimold or SOT-363 package
•
WIDE BAND OPERATION:
RF = 0.1 to 2.0 GHz
IF = 10 to 300 MHz
IF
Output
RF
Input
•
•
ON BOARD OSCILLATOR
SUPPLY VOLTAGE:
VCC = 2.7 TO 3.3 V
DESCRIPTION
NEC's UPC2756TB is a silicon MMIC integrated circuit manu-
factured using the NESAT III process. The device consists of
a double balance mixer, an IF amplifier and a built-in LO. this
device is suitable as a L-BAND downconverter for the receiver
stage of wireless systems. The UPC2756TB is pin compatible
and has comparable performance as the larger UPC2756T, so
it is suitable for use as a replacement to help reduce system
size. The IC housed in a 6 pin super minimold or SOT-363
package.
VCC
GND
LO1 LO2
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
ELECTRICAL CHARACTERISTICS (TA = 25°C, Vcc = 3 V, ZL = Zs = 50 Ω)
PART NUMBER
PACKAGE OUTLINE
UPC2756TB
S06
SYMBOLS
PARAMETERS AND CONDITIONS
Circuit Current (no signal)
UNITS
MIN
TYP
MAX
ICC
fRF
mA
3.5
6.0
8.0
RF Frequency Response
(3 dB down from the gain at fRF = 900 MHz, fIF = 150 MHz)
GHz
MHz
0.1
10
2.0
fIF
IF Frequency Response
(3 dB down from the gain at fRF = 900 MHz, fIF = 150 MHz)
300
CG
Conversion Gain1 fRF = 900 MHz, fIF = 150 MHz
fRF = 1.6 GHz, fIF = 20 MHz
dB
dB
11
11
14
14
17
17
NF
Noise Figure
fRF = 900 MHz, fIF = 150 MHz
fRF = 1.6 GHz, fIF = 20 MHz
dB
dB
10
13
13
16
PSAT
OIP3
ISO
Saturated Output Power2
fRF = 900 MHz, fIF = 150 MHz
fRF = 1.6 GHz, fIF = 20 MHz
dBm
dBm
-11
-15
-8
-12
SSB Output 3rd Order Intercept Point
fRF = 0.8~2.0 GHz, fIF = 100 MHz
dBm
+4
LO Leakage, fLO = 0.8 ~2.0 GHz
at RF pin
at IF pin
dBm
dBm
-35
-23
PN
Phase Noise3, fOSC = 1.9 GHz
dBc/Hz
-68
RTH (J-A)
Thermal Resistance (Junction to Ambient)
Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB
°C/W
325
Notes:
1. PRF = -40 dBm.
2. PRF = -10 dBm.
3. See Application Circuit.
California Eastern Laboratories