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UPC1676G-A PDF预览

UPC1676G-A

更新时间: 2024-11-18 13:15:11
品牌 Logo 应用领域
日电电子 - NEC 射频和微波射频放大器微波放大器
页数 文件大小 规格书
5页 71K
描述
Wide Band Low Power Amplifier, 1200MHz Max, MINIMOLD, 4 PIN

UPC1676G-A 技术参数

是否Rohs认证: 符合生命周期:Transferred
Reach Compliance Code:compliant风险等级:5.69
特性阻抗:50 Ω构造:COMPONENT
增益:19 dBJESD-609代码:e6
最大工作频率:1200 MHz最高工作温度:85 °C
最低工作温度:-40 °C射频/微波设备类型:WIDE BAND LOW POWER
端子面层:Tin/Bismuth (Sn/Bi)Base Number Matches:1

UPC1676G-A 数据手册

 浏览型号UPC1676G-A的Datasheet PDF文件第2页浏览型号UPC1676G-A的Datasheet PDF文件第3页浏览型号UPC1676G-A的Datasheet PDF文件第4页浏览型号UPC1676G-A的Datasheet PDF文件第5页 
UPC1676B  
UPC1676G  
UPC1676P  
1.2 GHz BANDWIDTH LOW  
NOISE SILICON MMIC AMPLIFIER  
UPC1676G  
NOISE FIGURE AND GAIN  
FEATURES  
vs. FREQUENCY AND VOLTAGE  
• WIDE BANDWIDTH:  
30  
20  
1200 MHz at 3 dB Point for UPC1676G  
1300 MHz at 3 dB Point for UPC1676B, UPC1676P  
V
CC = 5.5 V  
5.0 V  
4.5 V  
• HIGH POWER GAIN: 22 dB TYP AT f = 500 MHz  
• HIGH ISOLATION  
G
P
10  
• SINGLE POWER SUPPLY: VCC = 5 V  
• INPUT/OUTPUT MATCHED TO 50  
• AVAILABLE IN TAPE AND REEL (UPC1676G)  
V
CC = 5.5 V  
5
10  
NF  
5.0 V  
4.5 V  
0
0
500  
60  
100  
200  
1000  
2000  
DESCRIPTION  
Frequency, f (MHz)  
The UPC1676 is a silicon monolithic integrated circuit de-  
signed for wide-band amplifiers covering the VHF to UHF  
bands. The series is available in two package styles: a surface  
mount package (UPC1676G), and an 8 lead ceramic flat  
package(UPC1676B).Alsoavailablein chipform(UPC1676P).  
NEC's stringent quality assurance and test procedures en-  
sure the highest reliability and performance.  
ELECTRICAL CHARACTERISTICS(TA = 25°C, VCC = 5 V, f = 500 MHz)  
PART NUMBER  
PACKAGE OUTLINE  
UPC1676B1  
B08  
UPC1676G  
39  
UPC1676P  
CHIP  
SYMBOLS  
PARAMETERS AND CONDITIONS  
UNITS  
MIN TYP MAX MIN TYP MAX MIN TYP MAX  
ICC  
GS  
SupplyCurrent  
mA  
dB  
14  
18  
19  
20  
24  
22  
14  
19  
3
19  
22  
5
24  
24  
14  
19  
3
19  
22  
5
24  
24  
Small Signal Gain  
PSAT  
BW  
SaturatedOutputPower  
Bandwidth 3 dB down from gain at 100 MHz  
NoiseFigure  
dBm  
MHz  
dB  
3.5  
5.5  
1000 1300  
4.5  
1000 1200  
4.5  
1000 1300  
NF  
6
6
4.5  
21  
13  
6
RLIN  
RLOUT  
ISOL  
RTH(J-C)  
Input Return Loss  
dB  
18  
10  
24  
21  
13  
28  
9
6
12  
9
Output Return Loss  
dB  
Isolation  
dB  
24  
28  
24  
28  
Thermal Resistance (Junction to Case)  
°C/W  
50  
Note:  
1. Case must be connected to GND for stable RF operation and optimum thermal dissipation.  
California Eastern Laboratories  

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