Datasheet > UMB1M_17

UMB1M_17

更新时间： 2022-02-26 13:58:44

品牌	Logo	应用领域
迪一电子 - DYELEC		/
页数	文件大小	规格书
3页	1898K
描述
SINGLE PHASE 0.8AMP ULTRA FAST GLASS PASSIVATED BRIDGE RECTIFIER

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数据手册

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UMB1M_17 数据手册

UMB1M THRU UMB10M

SINGLE PHASE 0.8AMP ULTRA FAST GLASS PASSIVATED BRIDGE RECTIFIER

Features

Glass Passivated Die Construction

Low leakage

MBM

0.157（4.0）

Ideal for printed circuit board

0.134（3.4）

Surge overload rating-30A peak

Designed for Surface Mount Application

Plastic Material-UL Flammability 94V-0

0.012（0.30）

0.004（0.10）

0.028（0.7）

0.4

0.016（

）

（

）

0.236 6.0

0.051（1.3）

0.035（0.9）

（

0.213 5.4

）

0.106（2.7）

0.091（2.3）

Mechanical Data

Case:Reliable low cost construction

utilizing molded plastic technique

Terminals:Plated Leads Solderable per MIL-

STD-202,Method208

0.203（5.15）

0.179（4.55）

0.106（2.7）

0.091（2.3）

Polarity:As Marked on Case

Mounting Position:Any

0.193（4.90）

0.177（4.50）

dimensions in inches and (millimeters)

Marking:Type Number

Maximum Ratings and Electrical Characteristics

Rating at 25℃ambient temperature unless otherwise specified.

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

UNITS

SYMBOL UMB1M UMB2M UMB4M UMB6M UMB8M UMB10M

TYPE NUMBER

VRRM

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

1000

700

100

200

140

400

280

600

420

800

560

VRWM

VDC

RMS Reverse Voltage

VRMS

0.5

0.8

Average Rectified Output Current (Note 1)@TC=100℃

(Note 2)@TC=100℃

IF(AV)

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

IFSM

I²t Rating for Fusing (t < 8.3ms)

²s

²t

3.735

1.3

1.0

1.7

Forward Voltage per element @IF=0.8A

VFM

Peak Reverse Current

At Rated DC Blocking Voltage @TA=125℃

@TA=25℃

5.0

200

T_RR

Maximum reverse recovery time

（Note 3）

Typ

ical Junction Capacitance per leg (Note 4)

RθJA

Typical Thermal Resistance per leg

℃/W

RθJL

Operating and Storage Temperature Range

-55to+150

TJ,TSTG

℃

Note:1. Mounted on glass epoxy PC board with 1.3mm²solder pad.

2. Mounted on aluminum substrate PC board with 1.3mm²solder pad.

Reverse Recovery Test Conditions: IF=0.5A, IR=1A, Irr=0.25A.

4. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.

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