UMAF5817, UMAF5818, and UMAF5819
ULTRAMITE™ SURFACE MOUNT
SCHOTTKY BARRIER RECTIFIERS
S C O T T S D A L E D I V I S I O N
ENVIRONMENTALLY LEAD-FREE
DESCRIPTION
APPEARANCE
The UMAF5817 thru UMAF5819 UltraMite™ series offers a Lead-Free
construction (both internally and externally) in a small efficient surface
mount package with the same electrical features as the popular 1N5817,
1N5818, and 1N5819 Schottky rectifiers. It provides the same size footprint
as other small surface mount DO-214AC or BA package options except
with a much lower profile height. Its configuration in a “2010 MELF” style
robust package design prevents lead damage to terminals and also
minimizes parasitics by eliminating internal wire bonds and providing very
short internal conduction paths.
UltraMite™
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Plastic package has Underwriters Laboratory
•
•
For surface mount applications
Flammability classification 94V-0
For use in low-voltage high-frequency switching
power supplies, inverters, free wheeling, and
polarity protection applications
Low power loss, High efficiency
Low inductive parasitics for minimal Ldi/dt effects
•
•
•
•
•
•
Metal to silicon rectifier, majority carrier conduction
High current capability, low VF
Built-in stress relief with similar COE as PC boards
Lead-Free construction externally and internally
Optional Lead-Tin finish available (UMA5817-19)
Options for screening in accordance with MIL-PRF-
19500/586 for JAN, JANTX, JANTXV, and JANS
are available by adding MQ, MX, MV, or MSP
prefixes respectively to part numbers. For example,
designate a MXUMAFJ5819 for a JANTX screen.
•
•
•
Fits same small PCB footprints as popular
“SMAJxxx” or “SMBJxxx” Schottky devices in
JEDEC outlines DO-214AC (or BA) and DO-214AA
respectively except with much lower height profile
•
Robust 2010 MELF style package configuration for
pick-and-place handling
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
FRP substrate material and epoxy under-fill
•
•
•
Operating junction and storage temperature
range (TJ and TSTG): -50 oC to +125oC
package meeting UL94V-0
Terminals Tin plated (solderable per MIL-STD-750,
Method 2026)
Body marked with F817, F818, or F819
Cathode designated with band
Weight: 0.020 grams
Tape & Reel packaging per EIA-481-2 with 12 mm
tape and 3000 units/reel (7 inch reel) or 10,000
units/reel (13 inch reel)
Forward average rectified current (IO)
@TC=75oC: 1.0 Amp
•
•
•
•
Forward surge current (IFSM) 8.3 ms single half-
sine waveform superimposed on rated load
(JEDEC Method): 25 Amps
•
•
Typical thermal resistance (RθJL): 50 oC/W
Typical junction capacitance (CJ) at 1.0 MHz
and VR of 5.0 Volts: 65 pF for UMAF5817, and
46 pF for UMAF5818 and UMAF5819
•
See package dimensions on last page
•
Solder temperatures: 260 ºC for 10 s (maximum)
ELECTRICAL CHARACTERISTICS @ 25oC unless specified otherwise
Working
Maximum
Maximum
Maximum
Maximum
Maximum
dc reverse
current @
VRWM
Maximum dc
Peak
RMS
Peak
Forward
Forward
reverse
Reverse
Voltage
VRWM
Voltage;
Repetitive
Voltage;
VRRM
Voltage at 1.0A Voltage at 3.0A
current @
(note 1)
VF
(note 1)
VF
VRWM ,100oC
Part
VRMS
Volts
14
IR
IR
mA
10
Number
Volts
Volts
20
Volts
0.45
Volts
0.75
mA
UMAF5817 20
UMAF5818 30
UMAF5819 40
0.5
21
30
0.55
0.875
0.90
0.5
10
28
40
0.60
0.5
10
NOTES: (1) Pulse test with PW=300 µsec, 1% duty cycle.
Microsemi
Page 1
Copyright 2002
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
9-16-03 REV A
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