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UL634H256TC45 PDF预览

UL634H256TC45

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
SIMTEK 静态存储器光电二极管
页数 文件大小 规格书
14页 247K
描述
Non-Volatile SRAM, 32KX8, 45ns, CMOS, PDSO32, TSOP1-32

UL634H256TC45 数据手册

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UL634H256  
Low Voltage PowerStore 32K x 8 nvSRAM  
Features  
Description  
The UL634H256 has two separate The UL634H256 combines the  
! High-performance CMOS non-  
volatile static RAM 32768 x 8 bits modes of operation: SRAM mode high performance and ease of use  
! 35 and 45 ns Access Times  
! 15 and 20 ns Output Enable  
Access Times  
and nonvolatile mode. In SRAM of a fast SRAM with nonvolatile  
mode, the memory operates as an data integrity.  
ordinary static RAM. In nonvolatile STORE cycles also may be initia-  
operation, data is transferred in ted under user control via a soft-  
parallel from SRAM to EEPROM or ware sequence or via a single pin  
from EEPROM to SRAM. In this (HSB).  
! ICC = 8 mA at 200 ns Cycle Time  
! Automatic STORE to EEPROM  
on Power Down using external  
capacitor  
mode SRAM functions are disab- Once a STORE cycle is initiated,  
! Software initiated STORE  
! Automatic STORE Timing  
! 105 STORE cycles to EEPROM  
! 10 years data retention in  
EEPROM  
led.  
further input or output are disabled  
The UL634H256 is a fast static until the cycle is completed.  
RAM (35 and 45 ns), with a nonvo- Because a sequence of addresses  
latile electrically erasable PROM is used for STORE initiation, it is  
(EEPROM) element incorporated important that no other read or  
! Automatic RECALL on Power Up in each static memory cell. The write accesses intervene in the  
! Software RECALL Initiation  
! Unlimited RECALL cycles from  
EEPROM  
SRAM can be read and written an sequence or the sequence will be  
unlimited number of times, while aborted.  
independent nonvolatile data resi- RECALL cycles may also be initia-  
! Wide voltage range: 2.7 ... 3.6 V  
(3.0 ... 3.6 V for 35 ns type)  
! Operating temperature range:  
0 to 70 °C  
des in EEPROM.  
ted by a software sequence.  
Data transfers from the SRAM to Internally, RECALL is a two step  
the EEPROM (the STORE opera- procedure. First, the SRAM data is  
tion) take place automatically upon cleared and second, the nonvola-  
power down using charge stored in tile information is transferred into  
an external 68 µF capacitor. Trans- the SRAM cells.  
-40 to 85 °C (only 45 ns)  
-40 to 125 °C (only 45 ns)  
! QS 9000 Quality Standard  
! ESD protection > 2000 V  
(MIL STD 883C M3015.7-HBM)  
! Packages: SOP32 (300 mil)  
TSOP32 (Type I)  
fers from the EEPROM to the The RECALL operation in no way  
SRAM (the RECALL operation) alters the data in the EEPROM  
take place automatically on power cells. The nonvolatile data can be  
up.  
recalled an unlimited number of  
times.  
Pin Description  
Pin Configuration  
Signal Name Signal Description  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
32  
31  
30  
VCAP  
A14  
A12  
A7  
VCCX  
HSB  
W
1
n.c.  
A10  
E
G
A11  
A9  
2
2
A0 - A14  
DQ0 - DQ7  
Address Inputs  
Data In/Out  
3
3
4
29 DQ7  
A13  
A8  
4
A8  
5
DQ6  
DQ5  
DQ4  
DQ3  
VSS  
DQ2  
DQ1  
DQ0  
A0  
A6  
5
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
A13  
W
Chip Enable  
6
A5  
A9  
6
E
7
A4  
A11  
G
HSB  
VCCX  
VCAP  
A14  
A12  
A7  
7
Output Enable  
Write Enable  
8
A3  
8
G
W
SOP  
TSOP  
9
n.c.  
A2  
n.c.  
A10  
E
9
10  
11  
12  
13  
14  
15  
16  
10  
11  
12  
13  
14  
15  
16  
A1  
VCCX  
VSS  
VCAP  
Power Supply Voltage  
Ground  
Capacitor  
A0  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
A6  
DQ0  
DQ1  
DQ2  
VSS  
A1  
A5  
A2  
A4  
n.c.  
A3  
Top View  
Top View  
Hardware Controlled Store/Busy  
HSB  
1
October 20, 2003  

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