Datasheet > UG2DAFL

UG2DAFL

更新时间： 2023-12-06 20:11:25

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	2503K
描述
Tape&Reel: 10Kpcs/Reel;

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UG2DAFL 数据手册

UG2DAFL

Features

• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates

Compliant. See Ordering Information)

2 Amp

• Halogen Free. “Green” Device (Note 2)

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

• Low Switching Losses and High Efficiency

• Low Reverse Leakage

Surface-Mount

Ultrafast Rectifier

200 Volts

• Ultrafast Soft Recovery Time

Maximum Ratings

• Operating Junction Temperature Range: -55⁰C To +175⁰C

• Storage Temperature Range: -55⁰C To +175⁰C

• Thermal Resistance(Note 3): 10°C/W Junction to Case

• Thermal Resistance(Note 4): 25°C/W Junction to Lead

• Thermal Resistance(Note 4): 75°C/W Junction to Ambient

DO-221AC(SMA-FL)

Maximum

Cathode Mark

Maximum DC

Maximum

RMS

Voltage

MCC

Device

Recurrent

Peak Reverse

Voltage

Blocking

Voltage

Part Number

Marking

UG2DAFL

UG2D

200V

140V

200V

Electrical Characteristics @ 25°C Unless Otherwise Speciﬁed

Average Forward

Current

I_F(AV)

I_FSM

2.0A

65A

T_C=155⁰C

Peak Forward Surge

Current

8.3ms,Half Sine

I =2.0A;

T_J=25⁰C

Maximum Instantaneous

Forward Voltage

0.93V

0.77V

V_F

DIMENSIONS

I =2.0A;

T_J=125⁰C

INCHES

DIM

NOTE

Maximum DC Reverse

Current At Rated DC

Blocking Voltage

MIN MAX MIN MAX

0.035 0.049 0.90 1.25

0.049 0.065 1.25 1.65

0.004 0.016 0.10 0.40

0.089 0.116 2.25 2.95

0.173 0.220 4.40 5.60

2μA

10μA

T_J=25⁰C

T_J=125⁰C

I_R

Typical Junction

Capacitance

Measured at

1.0MHz, V_R=4.0V

C_J

30pF

E1 0.126 0.181 3.20 4.60

0.020 0.059 0.50 1.50

Dynamic Recovery Characteristics @ 25°C Unless Otherwise Specified

15ns(Typ.)

25ns(Max.)

I_F=0.5A; I_R=1.0A;

I_RR=0.25A

Reverse Recovery

Time

SUGGESTED SOLDER PAD LAYOUT

t_rr

inch

25ns(Typ.)

0.232

(5.9)

I_F= 3 A di_F/dt = 200 A/μs

V_R= 200 V,T_J=25⁰C

Peak recovery

current

I_RRM3.0A(Typ.)

40nC(Typ.)

0.075

(1.9)

Reverse recovery

charge

Q_rr

Note:

0.106

(2.7)

0.063

(1.6)

1. High Temperature Solder Exemptions Applied, See EU Directive Annex Notes 7a.

2. Halogen free "Green” products are defined as those which contain <900ppm bromine,

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

3. Mounted on P.C.B With 8 mm x 16 mm Copper Pad Areas.

4. Mounted on P.C.B. With 0.2" x 0.2" (5.0 mm x 5.0 mm) Copper Pad Areas.

Rev.3-3-04262021

1/3

MCCSEMI.COM

12 3

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