UCC28C41-Q1, UCC28C43-Q1, UCC28C45-Q1
www.ti.com
SLUSA12 –DECEMBER 2009
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
Check for Samples: UCC28C41-Q1 UCC28C43-Q1 UCC28C45-Q1
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FEATURES
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Rail-to-Rail Output Swings With 25-ns Rise
and 20-ns Fall Times
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Qualified for Automotive Applications
±1% Initial Trimmed 2.5-V Error Amplifier
Reference
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Enhanced Replacements for UC2842A Family
With Pin-to-Pin Compatibility
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Trimmed Oscillator Discharge Current
New Undervoltage Lockout Versions
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1-MHz Operation
50-μA Standby Current, 100-μA Maximum
Low Operating Current of 2.3 mA at 52 kHz
APPLICATIONS
Fast 35-ns Cycle-by-Cycle Overcurrent
Limiting
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Switch Mode Power Supplies
DC-to-DC Converters
Board Mount Power Modules
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±1-A Peak Output Current
DESCRIPTION
The UCC28C4x family are high performance current-mode PWM controllers. They are enhanced BiCMOS
versions with pin-for-pin compatibility to the industry standard UC284xA family and UC284x family of PWM
controllers. In addition, a lower startup voltage versions of 7 V is offered as UCC28C41.
Providing necessary features to control fixed frequency, peak current mode power supplies, this family offers
several performance advantages. These devices offer high frequency operation up to 1 MHz with low start up
and operating currents, thus minimizing start up loss and low operating power consumption for improved
efficiency. The devices also feature a fast current sense to output delay time of 35 ns, and a ±1-A peak output
current capability with improved rise and fall times for driving large external MOSFETs directly.
The UCC28C4x family is offered in the 8-pin SOIC (D) package.
ORDERING INFORMATION(1)
MAXIMUM
DUTY CYCLE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
TA
UVLO ON/OFF
PACKAGE(2)
100%
8.4 V / 7.6 V
8.4 V / 7.6 V
7.0 V / 6.6 V
UCC28C43QDRQ1(3)
UCC28C45QDRQ1(3)
UCC28C41QDRQ1
PREVIEW
–40°C to 125°C
SOIC – D
Reel of 2500
PREVIEW
28C41Q
50%
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) Product Preview
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Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2009, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.