UCC27200A, UCC27201A
www.ti.com
SLUSAF9A –FEBRUARY 2011–REVISED DECEMBER 2011
120-V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver
Check for Samples: UCC27200A, UCC27201A
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FEATURES
CONTENTS
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Specified from -40 °C to 140 °C
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Drives Two N-Channel MOSFETs in
High-Side/Low-Side Configuration
Device Ratings
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Electrical Characteristics
Device Information
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Maximum Boot Voltage 120 V
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Maximum VDD Voltage 20 V
Application Information
Additional References
On-Chip 0.65-V VF, 0.6-Ω RD Bootstrap Diode
Greater than 1 MHz of Operation
20-ns Propagation Delay Times
3-A Sink, 3-A Source Output Currents
8-ns Rise/7-ns Fall Time with 1000-pF Load
1-ns Delay Matching
DESCRIPTION
The UCC27200A/1A family of high frequency
N-Channel MOSFET drivers include 120-V
a
bootstrap diode and high-side/low-side driver with
independent inputs for maximum control flexibility.
This allows for N-Channel MOSFET control in
half-bridge, full-bridge, two-switch forward and active
clamp forward converters. The low-side and the
high-side gate drivers are independently controlled
and matched to 1-ns between the turn-on and turn-off
of each other. The UCC27200A/1A are based on the
popular UCC27200/1 drivers, but offer some
enhancements. In order to improve performance in
noisy power supply environments the UCC27200A/1A
has an enhanced ESD input structure and also has
the ability to withstand a maximum of -18 V on its HS
pin.
Under Voltage Lockout for High-Side and
Low-Side Driver
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Offered in 8-Pin SOIC (D), PowerPad™ SOIC-8
(DDA), SON-8 (DRM), SON-9 (DRC) and SON-10
(DPR) Packages
APPLICATIONS
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Power Supplies for Telecom, Datacom, and
Merchant Markets
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Half-Bridge Applications and Full-Bridge
Converters
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Isolated Bus Architecture
Two-Switch Forward Converters
Active-Clamp Forward Converters
High Voltage Synchronous-Buck Converters
Class-D Audio Amplifiers
Simplified Application Diagram
+100V
+12V
SECONDARY
SIDE
VDD
CIRCUIT
HB
HI
LI
DRIVE
HI
HO
HS
PWM
CONTROLLER
LO
DRIVE
LO
UCC27200A/1A
VSS
ISOLATION
AND
FEEDBACK
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated