是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP8,.3 |
针数: | 8 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | R-GDIP-T8 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
标称输出电压: | 2.5 V | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装等效代码: | DIP8,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 5.08 mm | 子类别: | Voltage References |
最大供电电压 (Vsup): | 20 V | 最小供电电压 (Vsup): | 4.3 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | BIPOLAR | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
微调/可调输出: | NO | 最大电压容差: | 1% |
宽度: | 7.62 mm | Base Number Matches: | 1 |
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