UC1825-DIE
www.ti.com
SLUSBO1 –JULY 2013
RAD-TOLERANT, HIGH-SPEED PWM CONTROLLER
Check for Samples: UC1825-DIE
1
FEATURES
(1)
•
Rad-Tolerant: 30 kRad (Si) TID
•
•
Wide Bandwidth Error Amplifier
•
Compatible With Voltage- or Current-Mode
Topologies
Fully Latched Logic With Double-Pulse
Suppression
•
•
•
Practical Operation Switching Frequencies
50-ns Propagation Delay-to-Output
•
•
•
•
Pulse-by-Pulse Current Limiting
Soft Start/Maximum Duty-Cycle Control
Undervoltage Lockout With Hysteresis
Low Start-Up Current
High-Current Dual Totem Pole Outputs
(1) Radiation tolerance is a typical value based upon initial device
qualification with dose rate = 10 mrad/sec. Radiation Lot
Acceptance Testing is available - contact factory for details.
DESCRIPTION
The UC1825-DIE PWM control device is optimized for high-frequency switched mode power supply applications.
Particular care was given to minimizing propagation delays through the comparators and logic circuitry while
maximizing bandwidth and slew rate of the error amplifier. This controller is designed for use in either current-
mode or voltage mode systems with the capability for input voltage feed-forward.
Protection circuitry includes a current limit comparator with a 1-V threshold, a TTL compatible shutdown port, and
a soft start pin which will double as a maximum duty-cycle clamp. The logic is fully latched to provide jitter-free
operation and prohibit multiple pulses at an output. An undervoltage lockout section with 800 mV of hysteresis
assures low start up current. During undervoltage lockout, the outputs are high impedance.
This device features totem pole outputs designed to source and sink high peak currents from capacitive loads,
such as the gate of a power MOSFET. The on state is designed as a high level.
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
UC1825VTD1
UC1825VTD2
88
10
UC1825
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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