UC1610

更新时间： 2024-11-30 22:17:51

品牌	Logo	应用领域
德州仪器 - TI		肖特基二极管
页数	文件大小	规格书
3页	164K
描述
Dual Schottky Diode Bridge

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UC1610 数据手册

UC1610

UC2610

UC3610

Dual Schottky Diode Bridge

FEATURES

DESCRIPTION

•

Monolithic Eight-Diode Array

This eight-diode array is designed for high-current, low duty-cycle applications

typical of flyback voltage clamping for inductive loads. The dual bridge connection

makes this device particularly applicable to bipolar driven stepper motors.

Exceptional Efficiency

Low Forward Voltage

Fast Recovery Time

High Peak Current

Small Size

The use of Schottky diode technology features high efficiency through lowered for-

ward voltage drop and decreased reverse recovery time.

This single monolithic chip is fabricated in both hermetic CERDIP and copper-

leaded plastic packages. The UC1610 in ceramic is designed for -55°C to +125°C

environments but with reduced peak current capability. The UC2610 in plastic and

ceramic is designed for -25°C to +125°C environments also with reduced peak

current capability; while the UC3610 in plastic has higher current rating over a 0°C

to +70°C temperature range.

ABSOLUTE MAXIMUM RATINGS

Peak Inverse Voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V

Peak Forward Current

UC1610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A

UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A

UC3610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A

Power Dissipation at TA = +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W

Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

Note: Consult Packaging Section of Databook for thermal limitations and considerations of

package.

CONNECTION DIAGRAMS

SOIC-16 (TOP VIEW)

DW Package

DIL-8 (TOP VIEW)

N or J Package

PLCC-20 (TOP VIEW)

Q Package

3/95

12 3

中文翻译

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UC1610 替代型号

型号	品牌	替代类型	描述	数据表
UC2610	TI	功能相似	Dual Schottky Diode Bridge
UC3610	TI	功能相似	DUAL SCHOTTKY DIODE BRIDGE

与UC1610相关器件

型号	品牌	获取价格	描述	数据表
UC1610_12	TI	获取价格	DUAL SCHOTTKY DIODE BRIDGE
UC1610DW	ETC	获取价格	BRIDGE/RING DIODE ARRAY\|SO
UC1610DWTR	ETC	获取价格	BRIDGE/RING DIODE ARRAY\|SO
UC1610J	TI	获取价格	DUAL SCHOTTKY DIODE BRIDGE
UC1610J883B	TI	获取价格	DUAL SCHOTTKY DIODE BRIDGE
UC1610N	ETC	获取价格	BRIDGE/RING DIODE ARRAY\|SO
UC1610Q	ETC	获取价格	BRIDGE/RING DIODE ARRAY\|LDCC
UC1610QTR	ETC	获取价格	BRIDGE/RING DIODE ARRAY\|LDCC
UC1611	TI	获取价格	Quad Schottky Diode Array
UC1611_11	TI	获取价格	QUAD SCHOTTKY DIODE ARRAY