Datasheet > UABS4??

UABS4??

更新时间： 2024-11-03 18:04:47

品牌	Logo	应用领域
辰达行 - MDD		/
页数	文件大小	规格书
3页	465K
描述
ABS

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中文翻译

获取价格

数据手册

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UABS4?? 数据手册

UABS2 THRU UABS10

Voltage Range - 200 to 1000 V olts Current - 0.8/1.0 Ampere

GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS

Features

ABS



Ideal for printed circuit board

Reliable low cost construction utilizing molded plastic technique

High temperature soldering guaranteed: 260°/10 seconds at 5

lbs., (2.3kg) tension

Small size, simple installation



High surge current capability

Glass passivated chip junction

Mechanical Data

（2）

（1）

Case : JEDEC ABS Molded plastic body

Terminals : Solder plated, solderable per MIL-STD-750,Method 2026

Polarity : Polarity symbol marking on body

Mounting Position: Any

（3）

（4）

Weight

: 0.003 ounce, 0.098 grams

Dimensions in inches and (millimeters)

Maximum Ratings And Electrical Characteristics

Ratings at 25°C ambient temperature unle ss otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

Parameter

MDD

UABS2

MDD

UABS4

MDD

UABS6

MDD

UABS8

MDD

UABS10

UNITS

SYMBOLS

Marking Code

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

V^RMS

V^DC

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Maximum DC blocking voltage

Maximum average forward rectified current

On glass-epoxy P.C.B.(Note1)

On aluminum substrate(Note2)

Peak forward surge current,

1000

0.8

1.0

I^F(AV)

I^FSM

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

Maximum instantaneous forward voltage drop

per leg at 0.4A

V^F

I^R

1.0

1.4

1.7

500

Maximum DC reverse current

at rated DC blocking voltage

T^A=25°C

T^A=100°C

Rθ^JL

Rθ^JA

°C/W

Typical thermal resistance(NOTE 3)

°C

trr

T^J

Maximum reverse recovery time

(NOTE 4)

Operating temperature range

-55 to +150

T^STG

storage temperature range

NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.

2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.

Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)

4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.

copper pads.

DN:T20520A0

http://www.microdiode.com

Rev:2020A0

Page :1

12 3

中文翻译

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