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UABF2 PDF预览

UABF2

更新时间: 2024-05-23 22:22:22
品牌 Logo 应用领域
星海 - CZSTARSEA /
页数 文件大小 规格书
2页 60K
描述
ABF

UABF2 数据手册

 浏览型号UABF2的Datasheet PDF文件第2页 
UABF2 THRU UABF10  
GLASS PASSIVATED ULTRA FAST RECOVERY BRIDGE RECTIFIERS  
Voltage Range - 200 to 1000 Volts Current - 0.8/1.0 Ampere  
FEATURES  
ABF  
Ideal for printed circuit board  
Reliable low cost construction utilizing  
molded plastic technique  
High temperature soldering guaranteed:  
260 / 10 seconds at 5 lbs., (2.3kg) tension  
Small size, simple installation  
Leads solderable per MIL-STD-202,  
Method 208  
High surge current capability  
Glass passivated chip junction  
Green compound(halogen&Sb2O3 free)  
MECHANICAL DATA  
Case: Molded plastic body  
Terminals: Plated leads solderable per MIL-STD-750,  
Method 2026  
Polarity: Polarity symbols marked on case  
Mounting Position: Any  
Dimensions in inches and (millimeters)  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25 ambient temperature unless otherwise specified.  
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.  
SYMBOLS  
UNITS  
UABF2  
UABF4  
UABF6  
UABF8  
UABF10  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
V
V
V
200  
140  
200  
400  
280  
400  
600  
420  
600  
800  
560  
800  
1000  
700  
Maximum DC blocking voltage  
Maximum average forward rectified current  
On glass-epoxy P.C.B.(Note1)  
On aluminum substrate(Note2)  
Peak forward surge current,  
1000  
IF(AV)  
IFSM  
0.8  
1.0  
A
30  
8.3ms single half sine-wave superimposed on  
rated load  
A
V
Maximum instantaneous forward voltage drop  
per leg at 0.4A  
VF  
IR  
1.0  
1.4  
1.7  
Maximum DC reverse current  
at rated DC blocking voltage  
TA=25  
uA  
uA  
5.0  
TA=125  
500  
R JL  
R JA  
28  
80  
Typical thermal resistance(NOTE 3)  
Maximum reverse recovery time  
/W  
ns  
(NOTE 4)  
trr  
50  
75  
Operating temperature range  
storage temperature range  
TJ  
-55 to +150  
-55 to +150  
TSTG  
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.  
2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.  
3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)  
4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.  
copper pads.  
DN:S14E02A0  
STAR SEA  

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