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U62H1708TK35 PDF预览

U62H1708TK35

更新时间: 2024-02-04 07:34:12
品牌 Logo 应用领域
SIMTEK 静态存储器光电二极管
页数 文件大小 规格书
10页 175K
描述
Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, TSOP1-32

U62H1708TK35 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:TSOP1包装说明:TSOP1,
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.39最长访问时间:35 ns
JESD-30 代码:R-PDSO-G32JESD-609代码:e0
长度:18.4 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:8 mmBase Number Matches:1

U62H1708TK35 数据手册

 浏览型号U62H1708TK35的Datasheet PDF文件第2页浏览型号U62H1708TK35的Datasheet PDF文件第3页浏览型号U62H1708TK35的Datasheet PDF文件第4页浏览型号U62H1708TK35的Datasheet PDF文件第5页浏览型号U62H1708TK35的Datasheet PDF文件第6页浏览型号U62H1708TK35的Datasheet PDF文件第7页 
U62H1708  
Automotive Fast 128K x 8 SRAM  
Features  
Description  
The U62H1708 is a static RAM  
manufactured using a CMOS pro-  
cess technology with the following  
operating modes:  
! 131072 x 8 bit static CMOS RAM  
! 35 and 55 ns Access Time  
! Common data inputs and  
data outputs  
available at the outputs DQ0-DQ7.  
After the address change, the data  
outputs go High-Z until the new  
information is available. The data  
outputs have no preferred state. If  
the memory is driven by CMOS  
levels in the active state, and if  
there is no change of the address,  
data input and control signals W or  
G, the operating current (IO = 0 mA)  
drops to the value of the operating  
current in the Standby mode. The  
Read cycle is finished by the falling  
edge of E2 or W, or by the rising  
edge of E1, respectively.  
- Read  
- Write  
- Standby  
! Three-state outputs  
! Typ. operating supply current  
35 ns: 45mA  
- Data Retention  
The memory array is based on a  
6-Transistor cell.  
55 ns: 30mA  
The circuit is activated by the rising  
edge of E2 (at E1 = L), or the falling  
edge of E1 (at E2 = H). The  
address and control inputs open  
simultaneously. According to the  
information of W and G, the data  
inputs, or outputs, are active.  
During the active state (E1 = L and  
E2 = H) each address change  
leads to a new Read cycle. In a  
Read cycle, the data outputs are  
activated by the falling edge of G,  
afterwards the data word will be  
! Standby current <200µA at 125°C  
! TTL/CMOS-compatible  
! Power supply voltage 5 V  
! Operating temperature range  
-40 °C to 85 °C  
-40 °C to 125 °C  
! QS 9000 Quality Standard  
! ESD protection > 2000 V  
(MIL STD 883C M3015.7)  
! Latch-up immunity >100 mA  
! Package: SOP32 (450 mil)  
TSOP I 32  
Data retention is guaranteed down  
to 2 V. With the exception of E1  
and E2, all inputs consist of NOR  
gates, so that no pull-up/pull-down  
resistors are required.  
sTSOP I 32  
Pin Configuration  
Pin Description  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
VCC  
A15  
E2  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
G
n.c.  
A16  
A14  
A12  
A7  
A11  
A9  
2
2
A10  
E1  
3
A8  
3
4
A13  
W
4
W
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
Signal Name Signal Description  
5
A13  
A8  
5
A0 - A16  
DQ0 - DQ7  
Address Inputs  
Data In/Out  
A6  
6
E2  
6
A5  
7
A9  
A15  
VCC  
n.c.  
A16  
A14  
A12  
A7  
7
Chip Enable 1  
Chip Enable 2  
Output Enable  
Write Enable  
Power Supply Voltage  
Ground  
E1  
E2  
G
TSOP  
SOP  
A4  
8
A11  
8
sTSOP  
A3  
9
9
G
A10  
VSS  
DQ2  
A2  
10  
11  
12  
13  
14  
15  
16  
10  
11  
12  
13  
14  
15  
16  
W
A1  
E1  
DQ7  
DQ1  
DQ0  
VCC  
VSS  
n.c.  
A0  
DQ0  
DQ1  
DQ2  
VSS  
DQ6  
DQ5  
DQ4  
DQ3  
A0  
A1  
A2  
A3  
not connected  
19  
18  
17  
A6  
19  
18  
17  
A5  
A4  
Top View  
Top View  
1
April 21, 2004  

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