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TWL1200YFFR PDF预览

TWL1200YFFR

更新时间: 2024-11-26 07:05:19
品牌 Logo 应用领域
德州仪器 - TI 线路驱动器或接收器驱动程序和接口接口集成电路
页数 文件大小 规格书
31页 685K
描述
SDIO, UART, AND AUDIO VOLTAGE-TRANSLATION TRANSCEIVER

TWL1200YFFR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:BGA
包装说明:WCSP-49针数:49
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.68Is Samacsys:N
差分输出:NO驱动器位数:1
接口集成电路类型:LINE TRANSCEIVER接口标准:GENERAL PURPOSE
JESD-30 代码:R-XBGA-B49JESD-609代码:e1
湿度敏感等级:1位数:19
功能数量:1端子数量:49
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE最大输出低电流:0.008 A
输出极性:TRUE封装主体材料:UNSPECIFIED
封装代码:VFBGA封装等效代码:BGA49,7X7,16
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.2/3.3 V
认证状态:Not Qualified最大接收延迟:
接收器位数:1座面最大高度:0.625 mm
子类别:Other Interface ICs最大压摆率:0.03 mA
最大供电电压:3.6 V最小供电电压:1.1 V
标称供电电压:2.5 V电源电压1-最大:3.6 V
电源电压1-分钟:1.1 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

TWL1200YFFR 数据手册

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TWL1200  
www.ti.com ...................................................................................................................................................................................................... SCES786JUNE 2009  
SDIO, UART, AND AUDIO VOLTAGE-TRANSLATION TRANSCEIVER  
1
FEATURES  
23  
Level Translator  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
VCCA and VCCB Range of 1.1 V to 3.6 V  
ESD Protection Exceeds JESD 22  
Seamlessly Bridges 1.8-V/2.6-V  
Digital-Switching Compatibility Gap Between  
2.6-V processors and TI’s Wi-Link (WL1271  
and WL1273)  
2500-V Human-Body Model (A114-B)  
250-V Machine Model (A115-A)  
1500-V Charged-Device Model (C101)  
YFF PACKAGE  
(TOP VIEW)  
ZQC PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
1 2  
4
3 6 7  
5
A
B
C
D
E
F
A
B
C
D
E
F
G
G
BGA PACKAGE TERMINAL ASSIGNMENTS  
1
2
3
4
AUD_DIR  
OE  
5
6
7
A
B
C
D
E
F
SDIO_CLK(A)  
SDIO_DATA3(A)  
SDIO_DATA2(A)  
WLAN_EN(A)  
SDIO_CMD(A)  
SDIO_DATA0(A)  
SDIO_DATA1(A)  
WLAN_IRQ(A)  
BT_EN(A)  
AUDIO_CLK(A)  
AUDIO_F-SYN(A)  
AUDIO_CLK(B)  
AUDIO_F-SYN(B)  
VCCB  
SDIO_CMD(B)  
SDIO_DATA0(B)  
SDIO_DATA1(B)  
WLAN_EN(B)  
SDIO_CLK(B)  
SDIO_DATA3(B)  
SDIO_DATA2(B)  
WLAN_IRQ(B)  
CLK_REQ(B)  
VCCA  
GND  
GND  
VCCA  
VCCB  
CLK_REQ(A)  
GND  
GND  
BT_EN(B)  
BT_UART_CTS(A)  
BT_UART_RX(A)  
BT_UART_RTS(A)  
BT_UART_TX(A)  
AUDIO_IN(A)  
AUDIO_OUT(A)  
SLOW_CLK(B)  
SLOW_CLK(A)  
AUDIO_IN(B)  
AUDIO_OUT(B)  
BT_UART_RTS(B)  
BT_UART_TX(B)  
BT_UART_CTS(B)  
BT_UART_RX(B)  
G
WCS PACKAGE TERMINAL ASSIGNMENTS  
1
2
3
4
AUD_DIR  
OE  
5
6
7
A
B
C
D
E
F
SDIO_CLK(A)  
SDIO_DATA3(A)  
SDIO_DATA2(A)  
WLAN_EN(A)  
SDIO_CMD(A)  
SDIO_DATA0(A)  
SDIO_DATA1(A)  
WLAN_IRQ(A)  
BT_EN(A)  
AUDIO_CLK(A)  
AUDIO_F-SYN(A)  
NC(1)  
AUDIO_CLK(B)  
AUDIO_F-SYN(B)  
VCCB  
SDIO_CMD(B)  
SDIO_DATA0(B)  
SDIO_DATA1(B)  
WLAN_EN(B)  
BT_EN(B)  
SDIO_CLK(B)  
SDIO_DATA3(B)  
SDIO_DATA2(B)  
WLAN_IRQ(B)  
CLK_REQ(B)  
VCCA  
GND  
VCCA  
VCCB  
CLK_REQ(A)  
GND  
GND  
GND  
BT_UART_CTS(A)  
BT_UART_RX(A)  
BT_UART_RTS(A)  
BT_UART_TX(A)  
AUDIO_IN(A)  
AUDIO_OUT(A)  
SLOW_CLK(B)  
SLOW_CLK(A)  
AUDIO_IN(B)  
AUDIO_OUT(B)  
BT_UART_RTS(B)  
BT_UART_TX(B)  
BT_UART_CTS(B)  
BT_UART_RX(B)  
G
(1) NC – No internal connection  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
MicroStar Junior is a trademark of Texas Instruments.  
MicroStar Junior, are trademarks of ~ Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  

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