TSU5511
www.ti.com
SCDS304 –SEPTEMBER 2010
SP3T SWITCH WITH IMPEDANCE DETECTION
MICRO-USB SWITCH TO SUPPORT USB, UART, AUDIO, AND CHARGER
Check for Samples: TSU5511
1
FEATURES
•
ESD Performance DP/DM/ID/VBUS to GND
•
Compatible Accessories
–
–
±8-kV Contact Discharge (IEC 61000-4-2)
±15-kV Air Gap Discharge (IEC 61000-4-2)
–
–
–
USB Data Cable
UART Cable
APPLICATIONS
Charger (Dedicated Charger or Host/Hub
Charger)
•
Cellular Telephones
–
Stereo Headset With Mic
YZP PACKAGE
(LASER SCRIBE VIEW)
•
•
•
Integrated LDOs for VREF and Mic Bias
USB Path Supports USB 2.0 High Speed
A
B
C
D
E
Audio Path Provides Negative Rail Support
and Click/Pop Reduction
4
3
2
1
•
•
•
Supports Factory Test Mode
1.8-V Compatible I2C Interface
ESD Performance Tested Per JESD 22
–
–
2000-V Human-Body Model
(A114-B, Class II)
PIN ASSIGNMENTS
1000-V Charged-Device Model (C101)
A
B
ISET
INT
C
D
E
4
3
2
1
MIC
UART_TX
UART_RX
DSS
USB_DM USB_DP
R2.2K
SDA
CLDO
ID
DP
DM
SCL
GND
VSUPPLY
AUDIO_R
AUDIO_L
VBUS
DESCRIPTION
The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a
micro-USB connector. The switch features impedance detection for identification of various accessories that are
attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the
switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to
the appropriate channel—data, audio, or UART.
The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An
interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated
when the device is unplugged.
Table 1. ORDERING INFORMATION
TA
PACKAGE(1) (2)
WSCP – YZP
(0.5-mm pitch)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
Tape and reel
TSU5511YZPR
5F2
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.