TSSOPand MSOP
Small Outline Packages
• Wide range of body sizes
• 8 to 56 lead counts
• Thermally enhanced versions
available (TSSOP-ep and
MSOP-ep)
FEATURES
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline
TSSOP
Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.
STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is
suitable for applications requiring a thin profile. TSSOP is a
leadframe based, plastic encapsulated package with gull wing
shaped leads on two sides with lead count ranging from 8 to
56 leads. The ultra thin TSSOP is made possible by optimal wire
looping control during the wire bonding process as well as
optimal package warpage control during the molding process.
TSSOP is designed to fill the niche of low pin count devices
where low profile and small footprint are key design consider-
ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is
ideal for low pin count analog and mixed signal devices in
handheld applications such as PDAs and mobile / cellular
phones.
Taking the reliability of Small Outline Packages (SOP) one
step further, STATS ChipPAC offers a Micro Small Outline
Package (MSOP) for applications requiring thin, small, and
high reliability. This smaller package offers a smaller footprint,
shorter wires for improved electrical connections, and better
moisture reliability (MRT/MSL).
• Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
• Lead Count: 8L to 56L
• Lead Pitch: 0.50mm & 0.65mm
• Package Height: 1.20mm max.
• JEDEC standard compliant (MO-153)
• Lead-free (Pb-free) and Green
• Thermal Enhancements: ep (exposed pad)
MSOP
• Body Size: 3 x 3mm
• Lead Count: 8L & 10L
• Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
• JEDEC standard compliant
• Lead-free (Pb-free) and Green
• Thermal enhancements: ep (exposed pad)
APPLICATIONS
• Analog and Operation Amplifiers
• Controllers and Drivers
In addition to standard TSSOP and MSOP, STATS ChipPAC
offers thermally enhanced “ep” versions featuring an exposed
die paddle for efficient heat dissipation. The exposed die
attach pad design of the TSSOP package can provide excellent
thermal dissipation by soldering the copper die attach pad
directly onto the PCB, and is ideal for low pin count analog and
mixed signal devices.
• Logic, Memory, and RF/Wireless
• Disk drives, video/audio and consumer electronics/
appliances
STATS ChipPAC uses the latest leadframe technology and
state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC’s
state of the art assembly facility and proven materials assure
high yield manufacturing and long term reliability.
www.statschippac.com
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